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User’s Manual U16702EE3V2UD00
Chapter 29
Recommended Soldering Conditions
V850E/RS1 should be soldered and mounted under the following recommended conditions.
For soldering methods and condition other than those recommended below, contact an NEC
Electronics sales representative. For technical information, see the follow website:
http://www.ee.nec.de
µPD70F3402GC(A1)-8EA
100-pin plastic LQFP (Fine pitch) (14
×
14)
µPD70F3403GC(A)-8EA
100-pin plastic LQFP (Fine pitch) (14
×
14)
µPD70F3403AGC(A)-8EA
100-pin plastic LQFP (Fine pitch) (14
×
14)
Note:
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable
storage period.
Caution:
Do not use different soldering methods together.
Table 29-1:
Soldering Conditions
Soldering Method
Soldering Condition
Symbol of
Recommended
Soldering Condition
Infrared reflow
Package peak temperature: 235°C,
Time: 30 seconds max. (at 210°C or higher),
Count: 3 times or less,
Exposure limits: 7days
Note
(after that, prebake at 125°C
for 20 to 72 hours)
IR35-207-3
VPS
Package peak temperature: 215°C,
Time: 25 to 40 seconds max. (at 200°C or higher),
Count: 3 times or less,
Exposure limits: 7days
Note
(after that, prebake at 125°C
for 20 to 72 hours)
VP15-207-3
Partial heating
Pin temperature: 350°C max.
Time: 3 seconds max. (per pin row)
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