532
Table 20.20 Bus Timing (2) (cont)
Conditions: V
CC
= 3.3 V ±0.3V, AV
CC
= 3.3 V ±0.3V, AV
CC
= V
CC
±0.3V, AV
ref
= 3.0 V to
AV
CC
, V
SS
= AV
SS
= 0 V,
φ
= 12.5 MHz, Ta = –20 to +75°C*
Note: * Regular-specification products; for wide-temperature-range products, Ta = –40 to +85°C
Item
Symbol
Min
Max
Unit
Figures
AH
delay time 1
t
AHD1
—
40
ns
20.63
AH
delay time 2
t
AHD2
—
40
ns
Multiplexed address delay time t
MAD
—
40
ns
Multiplexed address hold time
t
MAH
–10
—
ns
DACK0, DACK1 delay time 1
t
DACD1
—
40
ns
20.52, 20.53, 20.55–
20.58, 20.63, 20.64
DACK0, DACK1 delay time 2
t
DACD2
—
40
ns
DACK0, DACK1 delay time 3
*
5
t
DACD3
—
40
ns
20.53, 20.57, 20.58,
20.63
DACK0, DACK1 delay time 4
t
DACD4
—
40
ns
20.55, 20.56
DACK0, DACK1 delay time 5
t
DACD5
—
40
ns
Read delay time
35% duty
*
1
t
RDD
—
t
cyc
×
0.35 + 35
ns
20.52, 20.53, 20.55–
50% duty
—
t
cyc
×
0.5 + 35
ns
20.59, 20.63
Data setup time for
CAS
t
DS
0
*
3
—
ns
20.55, 20.57
CAS
setup time for
RAS
t
CSR
10
—
ns
20.60–20.62
Row address hold time
t
RAH
10
—
ns
20.55, 20.57
Write command hold time
t
WCH
15
—
ns
Write command
35% duty
*
1
t
WCS
0
—
ns
20.55
setup time
50% duty
0
—
ns
Access time from
CAS
precharge
*
4
t
ACP
t
cyc
−
20
—
ns
20.56
Notes:
*
1 When frequency is 10 MHz or more.
*
2 n is the number of wait cycles.
*
3 –5ns for parity output of DRAM long-pitch access.
*
4 If the access time is satisfied, t
RDS
need not be satisfied.
*
5 In the relationship between t
CASD2
and t
CASD3
for t
DACD3
, the pair of Min-Max is not
exist in the logical structure.
Summary of Contents for HD6417032
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Page 525: ...490 CK RAS CAS TRp TRc TRcc tRASD1 tRASD2 tCASD3 tCASD2 TRr tCSR Figure 20 18 Self Refresh ...
Page 578: ...543 CK RAS CAS TRp TRc TRcc tRASD1 tRASD2 tCASD3 tCASD2 TRr tCSR Figure 20 62 Self Refresh ...
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