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Cypress Semiconductor Corporation

198 Champion Court

San Jose

,

CA 95134-1709

408-943-2600

Document Number: 001-08351 Rev. *C

 Revised January 16, 2009

CY7C1034DV33

6-Mbit (256K X 24) Static RAM

Features

High speed

t

AA

 = 10 ns

Low active power

I

CC

 = 175 mA at 10 ns

Low CMOS standby power

I

SB2

 = 25 mA 

Operating voltages of 3.3 ± 0.3V

2.0V data retention 

Automatic power down when deselected

TTL compatible inputs and outputs

Easy memory expansion with CE

1

, CE

2

, and CE

3

 features

Available in Pb-free standard 119-Ball PBGA

Functional Description

The CY7C1034DV33 is a high performance CMOS static RAM

organized as 256K words by 24 bits. This device has an

automatic power down feature that significantly reduces power

consumption when deselected. 
To write to the device, enable the chip (CE

1

 LOW, CE

2

 HIGH,

and CE

3

 LOW) while forcing the Write Enable (WE) input LOW. 

To read from the device, enable the chip by taking CE

1

 LOW, CE

2

HIGH, and CE

3

 LOW, while forcing the Output Enable (OE) LOW

and the Write Enable (WE) HIGH. See the 

Truth Table

 on page

7 for a complete description of Read and Write modes.
The 24 IO pins (IO

to IO

23

) are placed in a high impedance state

when the device is deselected (CE

1

 HIGH, CE

2

 LOW, or CE

3

HIGH) or when the output enable (OE) is HIGH during a write

operation. (CE

1

 LOW, CE

2

 HIGH, CE

3

 LOW, and WE LOW).

COLUMN

DECODER

ROW DE

CO

DE

R

SE

NSE

 AM

PS

INPUT BUFFER

256K x 24

ARRAY

IO

– IO

23

OE

CE

1

, CE

2

, CE

3

WE

CONTROL LOGIC

Logic Block Diagram

A

(9:0)

A

(17:10)

[+] Feedback 

Summary of Contents for CY7C1034DV33

Page 1: ...This device has an automatic power down feature that significantly reduces power consumption when deselected To write to the device enable the chip CE1 LOW CE2 HIGH and CE3 LOW while forcing the Write Enable WE input LOW To read from the device enable the chip by taking CE1 LOW CE2 HIGH and CE3 LOW while forcing the Output Enable OE LOW and the Write Enable WE HIGH See the Truth Table on page 7 fo...

Page 2: ...A NC C IO12 NC CE2 A CE3 NC IO0 D IO13 VDD VSS VSS VSS VDD IO1 E IO14 VSS VDD VSS VDD VSS IO2 F IO15 VDD VSS VSS VSS VDD IO3 G IO16 VSS VDD VSS VDD VSS IO4 H IO17 VDD VSS VSS VSS VDD IO5 J NC VSS VDD VSS VDD VSS NC K IO18 VDD VSS VSS VSS VDD IO6 L IO19 VSS VDD VSS VDD VSS IO7 M IO20 VDD VSS VSS VSS VDD IO8 N IO21 VSS VDD VSS VDD VSS IO9 P IO22 VDD VSS VSS VSS VDD IO10 R IO23 NC NC NC NC NC IO11 T ...

Page 3: ...GND VOUT VCC output disabled 1 1 μA ICC VCC Operating Supply Current VCC Max f fMAX 1 tRC IOUT 0 mA CMOS levels 175 mA ISB1 Automatic CE Power Down Current TTL Inputs Max VCC CE1 CE3 VIH CE2 VIL VIN VIH or VIN VIL f fMAX 30 mA ISB2 Automatic CE Power Down Current CMOS Inputs Max VCC CE1 CE3 VCC 0 3V CE2 0 3V VIN VCC 0 3V or VIN 0 3V f 0 25 mA Capacitance Tested initially and after any design or pr...

Page 4: ...ists of all components of the test environment Rise Time 1V ns Including jig and scope Notes 4 Valid SRAM operation does not occur until the power supplies reach the minimum operating VDD 3 0V 100 μs tpower after reaching the minimum operating VDD normal SRAM operation begins including reduction in VDD to the data retention VCCDR 2 0V voltage 5 Test conditions assume signal transition time of 3 ns...

Page 5: ...s tR 12 Operation Recovery Time tRC ns Figure 3 Data Retention Waveform AC Switching Characteristics continued Over the operating range 5 Parameter Description 10 Unit Min Max 3 0V 3 0V tCDR VDR 2V DATA RETENTION MODE tR CE VCC Notes 9 The internal write time of the memory is defined by the overlap of CE1 LOW CE2 HIGH CE3 LOW and WE LOW Chip enables must be active and WE must be LOW to initiate a ...

Page 6: ... 50 50 DATA VALID tRC tACE tDOE tLZOE tLZCE tPU HIGH IMPEDANCE tHZOE tHZCE tPD HIGH ICC ISB IMPEDANCE OE CE ADDRESS DATA OUT VCC SUPPLY CURRENT tWC DATA VALID tAW tSA tPWE tHA tHD tSD tSCE tSCE CE WE DATA IO ADDRESS Notes 13 Device is continuously selected OE CE VIL 14 WE is HIGH for read cycle 15 Address valid before or similar to CE transition LOW 16 Data IO is high impedance if OE VIH 17 If CE ...

Page 7: ...own Standby ISB X X H X X High Z Power Down Standby ISB L H L L H Full Data Out Read Active ICC L H L X L Full Data In Write Active ICC L H L H H High Z Selected Outputs Disabled Active ICC Switching Waveforms continued tHD tSD tPWE tSA tHA tAW tSCE tWC tHZOE DATAIN VALID NOTE 18 CE ADDRESS WE DATA IO OE DATA VALID tHD tSD tLZWE tPWE tSA tHA tAW tSCE tWC tHZWE NOTE 18 CE ADDRESS WE DATA IO Note 18...

Page 8: ...dering Information Speed ns Ordering Code Package Name Package Type Operating Range 10 CY7C1034DV33 10BGXI 51 85115 119 Ball Plastic Ball Grid Array 14 x 22 x 2 4 mm Pb Free Industrial Package Diagram Figure 9 119 Ball PBGA 14 x 22 x 2 4 mm 51 85115 B Feedback ...

Page 9: ...s without further notice to the materials described herein Cypress does not assume any liability arising out of the application or use of any product or circuit described herein Cypress does not authorize its products for use as critical components in life support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user The inclusion of Cypress ...

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