495
Table 20.7
Bus Timing (2) (cont)
Conditions: V
CC
= 3.0 to 5.5 V, AV
CC
= 3.0 to 5.5 V, V
CC
= AV
CC
±10%, AV
ref
= 3.0 V to
AV
CC
, V
SS
= AV
SS
= 0 V,
φ
= 12.5 MHz, Ta = –20 to +75°C*
Note:
* Regular-specification products; for wide-temperature-range products, Ta = –40 to +85°C
Item
Symbol Min Max
Unit
Figures
DACK0, DACK1 delay time 1
t
DACD1
—
40
ns
20.21, 20.22, 20.24–
DACK0, DACK1 delay time 2
t
DACD2
—
40
ns
20.27, 20.32, 20.33
DACK0, DACK1 delay time 3
*
5
t
DACD3
—
40
ns
20.22, 20.26, 20.27,
20.32
DACK0, DACK1 delay time 4
t
DACD4
—
40
ns
20.24, 20.25
DACK0, DACK1 delay time 5
t
DACD5
—
40
ns
Read delay time 35% duty
*
1
t
RDD
—
t
cyc
×
0.35 + 35
ns
20.21, 20.22, 20.24-
50% duty
—
t
cyc
×
0.5 + 35
ns
20.28, 20.32
Data setup time for
CAS
t
DS
0
*
3
—
ns
20.24, 20.26
CAS
setup time for
RAS
t
CSR
10
—
ns
20.29–20.31
Row address hold time
t
RAH
10
—
ns
20.24, 20.26
Write command hold time
t
WCH
15
—
ns
Write command
35% duty
*
1
t
WCS
0
—
ns
20.24
setup time
50% duty
t
WCS
0
—
ns
Access time from
CAS
precharge
*
4
t
ACP
tcyc
–20
—
ns
20.25
Notes:
*
1 When frequency is 10 MHz or more.
*
2 n is the number of wait cycles.
*
3 –5 ns for parity output of DRAM long-pitch access
*
4 It is not necessary to meet the t
RDS
specification as long as the access time
specification is met.
*
5 In the relationship of t
CASD2
and t
CASD3
with respect to t
DACD3
, a Min-Max combination
does not occur because of the logic structure.
Summary of Contents for HD6417032
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Page 525: ...490 CK RAS CAS TRp TRc TRcc tRASD1 tRASD2 tCASD3 tCASD2 TRr tCSR Figure 20 18 Self Refresh ...
Page 578: ...543 CK RAS CAS TRp TRc TRcc tRASD1 tRASD2 tCASD3 tCASD2 TRr tCSR Figure 20 62 Self Refresh ...
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