479
Table 20.6
Bus Timing (1) (cont)
Conditions: V
CC
= 5.0 V ±10%, AV
CC
= 5.0 V ±10%, AV
CC
= V
CC
±10%, AV
ref
= 4.5 V to
AV
CC
, V
SS
= AV
SS
= 0 V,
φ
= 20 MHz, Ta = –20 to +75°C*
Note: * Regular-specification products; for wide-temperature-range products, Ta = –40 to +85°C
Item
Symbol
Min
Max
Unit
Figures
AH
delay time 1
t
AHD1
—
20
ns
20.19
AH
delay time 2
t
AHD2
—
20
ns
Multiplexed address delay time t
MAD
—
30
ns
Multiplexed address hold time
t
MAH
0
—
ns
DACK0, DACK1 delay time 1
t
DACD1
—
23
ns
20.8, 20.9, 20.11–
20.14, 20.19, 20.20
DACK0, DACK1 delay time 2
t
DACD2
—
23
ns
DACK0, DACK1 delay time 3
*
7
t
DACD3
—
20
ns
20.9, 20.13, 20.14,
20.19
DACK0, DACK1 delay time 4
t
DACD4
—
20
ns
20.11, 20.12
DACK0, DACK1 delay time 5
t
DACD5
—
20
ns
Read delay time
35% duty
*
2
t
RDD
—
t
cyc
×
0.35 + 12
ns
20.8, 20.9, 20.11–
50% duty
—
t
cyc
×
0.5 + 15
ns
20.15, 20.19
Data setup time for
CAS
t
DS
0
*
5
—
ns
20.11, 20.13
CAS
setup time for
RAS
t
CSR
10
—
ns
20.16–20.18
Row address hold time
t
RAH
10
—
ns
20.11, 20.13
Write command hold time
t
WCH
15
—
ns
Write command
35% duty
*
2
t
WCS
0
—
ns
20.11
setup time
50% duty
t
WCS
0
—
ns
Access time from
CAS
precharge
*
6
t
ACP
t
cyc
−
20
—
ns
20.12
Notes:
*
1 HBS and LBS signals are 25 ns.
*
2 When frequency is 10 MHz or more.
*
3 n is the number of wait cycles.
*
4 Access time from addresses A0 to A21 is tcyc-25 ns.
*
5 –5ns for parity output of DRAM long-pitch access.
*
6 It is not necessary to meet the t
RDS
specification as long as the access time
specification is met.
*
7 In the relationship of t
CASD2
and t
CASD3
with respect to t
DACD3
, a Min-Max combination
does not occur because of the logic structure.
Summary of Contents for HD6417032
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Page 525: ...490 CK RAS CAS TRp TRc TRcc tRASD1 tRASD2 tCASD3 tCASD2 TRr tCSR Figure 20 18 Self Refresh ...
Page 578: ...543 CK RAS CAS TRp TRc TRcc tRASD1 tRASD2 tCASD3 tCASD2 TRr tCSR Figure 20 62 Self Refresh ...
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