Power and clock management
RM0082
822/844
Doc ID 018672 Rev 1
Figure 109. Clock supply
37.8 Power
consumption
The following diagrams show different states (SLOW, DOZE and SLEEP) and, for NORMAL
results of Dynamic Frequency Scaling and Statically Frequency Selection, Dynamic Clock
Switching and Statically Clock off techniques. When DRAM is in self refresh, code is
executed from internal RAM.
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:
:
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1
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3
3
3
3
3
3
3
3
3
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2
2
2
4
4
4
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f
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6
6
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:
:
:
2
2
2
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:
:
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2
2
2
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4
4
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2
2
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3
3
3
3
3
3
3
3
3
M
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H
H
H
z
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Multi- layer AHB interconnect matrix
High Speed
subsystem
Ethernet
Mac
USB 2.0
device
Giga
Ethernet
JTAG/ETM9
USB 2.0
host
3 4
1
2-12(4)
5-23
7-34
8-5
F
L
R
econfigurable
A
rray
S
ubsystem
CPU
ARM subsystem
ARM926EJS
32kI/32kD cache
Coprocessor
TCM-I/D
GPIO
Int.Ctrl
Timer
Q P M
RI-O
M0
M1
M2
cfg
M3
M4
2
H
Low Speed
subsystem
D
ADC
Uart
SPI
I2C
IrDA
JPEG
codec
RAM
8KB
5
Basic subsystem
Timer
WDT
Misc.
ROM
32KB
DMA
8 chan.
B
Timer
RTC
GPIO
Flash
serial
System
Ctrl
1-123
6-67
G
Application
subsystem
C3
C
I
E
A
9-4
10-6
7
6
4-12
USB 2.0
host
SPEAr320
74.5
kB
RAM
Cuts:
Half Dual Port
(AHB wired):
2048 * 32 * 1
Dual Port:
96 * 128 * 1
1024 * 32 * 4
128 * 8 * 8
Single Port:
2048 * 32 * 2
1024 * 32 * 2
512 * 32 * 4
2048 *
8 * 8
Wo
rds
n
um
.
b
its w
id
e
ins
ta
nces
nu
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be
r
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3
3
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1
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2
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=
1
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6
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6
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3
3
3
4
4
4
8
8
8
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:
:
:
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r
r
r
P
P
P
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2
2
2
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P
P
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3
3
3
,
,
,
4
4
4
8
8
8
M
M
M
H
H
H
z
z
z
Cell Array
300Kgates
SDRAM
Ctrl DDR1-2