RM0082
Product overview
Doc ID 018672 Rev 1
4.3
System architecture overview
4.3.1 Core
architecture
The internal architecture is based on several-shared subsystem logics interconnected
through a multilayer interconnection matrix as shown in the
.
Figure 2.
SPEAr300 - Core architecture overview
The switch matrix structure allows different subsystem dataflows to be executed in parallel
improving the core platform efficiency.
High performance master agents are directly interconnected with the memory controller
reducing the memory access latency. Three different memory paths (two of them shared
with other masters) are reserved for the programmable logic to enhance the user application
Multi- layer AHB interconnect matrix
SDRAM
Ctrl DDR1-2
High Speed
subsystem
Ethernet
Mac
USB 2.0
device
JTAG/ETM9
Reconfigurable Array Subsystem
(RAS)
USB 2.0
host
3
4
1
2-
12(
4)
5-
2
3
7-
3
4
8-5
F
L
R
econfigurable
A
rray
S
ubsystem
CPU
ARM
subsystem
ARM926EJS
Coprocessor
TCM-I/D
GPIO
Int.Ctrl
Timer
Q P M
RI-O
M
0
M
1
M
2
cf
g
M
3
M
4
102
USB
device
56
0/18
MII
to PHY
USB
Host
Oscillator
0
÷
6
0
÷
7
0
÷
2
0
÷
2
98 GPIO, 4clk
Master
reset
10
2
H
Low Speed
subsystem
D
ADC
Uart
SPI
I2C
IrDA
JPEG
codec
RAM
8KB
5
Basic subsystem
Timer
WDT
Misc.
ROM
32KB
DMA
8 chan.
B
Timer
RTC
GPIO
Flash
serial
System
Ctrl
2
5
2
1
0
÷
6
1-
12
3
6-
6
7
G
Application
subsystem
C3
C
I
E
A
9-4
1
0
-6
7
6
4-
1
2
Debug
12
8 ch.
Master
clock
0
÷
8
DDR
USB 2.0
host
4
USB
Host
3-
1
2
4
3
SPEAr300
instances number
- TDM/BUS (512 timeslots)
- I2S
- Camera
- SDIO
- TFT/STN CLCD controller
- FSMC
- Keyboard
- GPIO
16+16KB-I/D Cache
- Upto 8 addiitonal I2C/SPI
chip selects
Words num.
bits wide
74.5
kB
RAM
Cuts:
Half Dual Port
(AHB wired):
2048 * 32 * 1
Dual Port:
96 *128 * 1
1024 * 32 * 4
128 * 8 * 8
Single Port:
2048 * 32 * 2
1024 * 32 * 2
512 * 32 * 4
2048 * 8 * 8