IBM pSeries 670, Service Manual

Page: 953 / 1032

I/O Subsystem Chassis
Removal
Attention: This process requires:
v
The use of a lift tool (part number 09P2481) and lift-plate assembly tool (part number 11P4369).
v
The lift tool wheels must be chocked to prevent the chassis from moving during the operation. The
frame must not be on its casters, the leveling pads must be engaged to prevent the frame from moving
during the operation.
1. Read all safety instructions before performing this operation. Unpack lift tool and follow assembly
instructions included with the tool. Inspect the tool for damage (do not perform the remove procedure
with a damaged lift tool). Replace the blue lift plate with the orange lift plate (P/N 11P4369). Orient
two round holes in lift plate to the side of the lift tool that will be closest to the frame.
2. Turn off power as described in “Powering Off and Powering On the System” on page 779.
3. Unplug all power cables from the line power source.
Attention: Because this procedure is performed with power removed from the system, references
to using the white or green service buttons on the UEPO switch do not apply during the remainder of
this procedure.
4. Open the rack doors and remove them from the rack.
5. Remove the I/O subsystem front cover.
6. If your system is configured with a half I/O drawer filler plate, remove the filler plate.
7. Verify that all cables are labeled. If not, then label all cables and components along with their location
at the front and rear of your system.
8. Remove all DASD hard disk drives or DASD fillers as described in the removal section of “I/O
Subsystem DASD Hard Disk Drive Assembly” on page 929.
9. Remove all DASD 4-pack or 4-pack filler assemblies as described in the removal section of “I/O
Subsystem DASD 4-Pack” on page 931.
10. Remove all DCA units as described in the removal section of “I/O Subsystem Distributed Converter
Assembly (DCA)” on page 925.
11. Remove all I/O subsystem fan assemblies as described in the removal section of “I/O Subsystem
Fan” on page 932.
12. Remove all PCI adapter cassettes as described in the removal section of “PCI Adapters” on
page 851.
13. Remove the I/O backplanes (up to 2) as described in the removal section of “I/O Subsystem I/O
Backplane Assembly” on page 927.
14. Remove the screws that attach the I/O subsystem chassis to the rack.
15. Position the lift tool at the front of the rack. Align the lift tool so that I/O subsystem chassis will not be
blocked (at the lip of the orange lift plate) from removal. Install wheel chocks on the lift tool casters.
Engage the lift tool brake.
16. Raise the plate to a height such that the lift plate is just below the base of the I/O subsystem chassis
you are removing. Release pins on the extender arms and position them on both left and right side.
Arms must fit around the frame extenders and lock in place (do not adjust the lift tool after these
arms are locked in place).
17. One person should gently pull and guide the I/O subsystem chassis onto the lift plate. The I/O
subsystem chassis must be removed far enough to clear the front face of the frame. Retract the
extender arms.
18. Lower I/O subsystem chassis to the bottom position of the lift tool.
19. Remove the wheel chocks and release the brake. Flip the crank handle 180 degrees. Carefully move
the lift tool with the I/O subsystem chassis to the staging area. The brake and wheel chocks must be
in place when transferring the I/O subsystem chassis to or from the packaging material.
Chapter 9. Removal and Replacement Procedures
933