IBM pSeries 670, Service Manual

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3. Position the plate at the correct level, and move the new processor subsystem chassis onto the tool
with the rear side flush with the lift plate. Strap the processor subsystem chassis to the lift plate using
the tie-down strap.
4. Position the lift tool as close as possible to the front of the rack.
5. Raise the lift tool until it is level with the rails.
6. Release the pins on the lift plate and fully extend the center portion of the plate toward the frame and
lock it in place. Release the pins on the extender arms and position them on both left and right side.
The arms must fit around the frame extenders and lock in place (do not adjust the lift tool after these
arms are locked in place). Engage the lift tool brake. Install wheel chocks on lift tool casters.
Note: When you attach the arms to the frame, ensure that any cables are clear of the extender arms.
7. Remove the tie-down strap. One person should gently pull the processor subsystem chassis into the
frame from the rear of the system (do not bend the vertical processor-subsystem chassis support
bars). Two people should gently push and guide the processor subsystem chassis into the frame.
Note: Adjust the height of the lift plate, as needed.
8. After the processor subsystem chassis is installed in the frame, lower the lift plate and remove it from
the lift tool. Repackage the lift tool.
9. Reinstall all components removed during the removal process by reversing steps 22 on page 846
through 2 on page 845 of the removal procedure.
Memory Books and Memory Blanks
Removal
1. Turn off the system, and completely remove power as described in “Powering Off and Powering On the
System” on page 779.
2. Remove the safety bar from the memory slot.
3. Grasp the blue release latches located at the top and bottom of the memory book between your thumb
and index finger, and press the tabs together. Pivot the tabs and pull the book straight back.
Inspection
You must examine the connector for any connector damage on the removed book using the 3X
Magnification Glass (part number 11P4747) included in the system toolkit. If you identify a defect on the
book, do not install the replacement card without contacting your next level support for instructions.
Note: For visual examples of damaged connectors, view the document on CORE, under 7040, entitled
7040-681 Memory and I/O Book Inspection Procedure .
A damaged connector on a defective book may indicate a damaged system backplane. If the memory
book connector is damaged, the adjacent memory book may need to be removed in order to inspect the
system backplane for damage.
If the removed book is not damaged, carefully remove the new book from the packaging. Be sure to
protect the connector and the blue handles when you remove the book from the cardboard box or ESD
bag. Do not handle the book by its connector or either of its blue handles. Remove the protective cover
from the connector and install it on the defective book.
Notes:
1. Do not stack books on top of each other. ESD bags do not provide sufficient stacking protection.
2. Do not rest a book on its connector or on its blue handles at any time.
After the memory book is removed from the ESD bag, examine the book VHDM connector using the 3X
Magnification Glass (part number 11P4747) included in the system toolkit. If any connector shows signs of
damage, do not use it.
Chapter 9. Removal and Replacement Procedures
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