MagnaTran 7.1 User’s Manual
Maintenance and Repair
MN-003-1600-00
Pads on End Effectors Inspection
Brooks Automation
Revision 2.2
9-11
Pads on End Effectors Inspection
Over time, repeated wafer transfers will wear away the surface of the pad, and
decrease its friction. It is necessary to inspect these pads to prevent wafer slippage
and loss of repeatability.
Required Tools
•
none
Follow these procedures to inspect the Pads of the End Effectors:
1.
Extend the end effector into the load lock or process module.
2.
Visually inspect the surface of the pads for excessive wear or damage.
If any of the above inspection points report a discrepancy, refer to
Removal/Replacement on page 9-32
for the procedure for replacing Kalrez or Adhe-
sive backed pads.
