TM 11-6625-3145-14
Operating Instructions-318/338 Service
When the probes are supplied with the instrument they will already be marked as the External Clock Probe and the Serial
Data Input Probe, and their compensations will be properly adjusted. If a replacement probe has been ordered it will not
be marked and the compensation will be set at 40 pF. If you are replacing the Serial Data Input Probe no change in
compensation is necessary; simply mark the probe for identification purposes. If you are replacing the External Clock
Probe you must adjust the probe compensation to 20 pF according to the procedure described in the preceding
paragraphs. Be sure to mark the probe for identification purposes.
SER Test. This test is only available with the 318S1 and 338S1. It requires the optional Self Test Adapter (013-0173-01).
Contact your Tektronix sales representative if you need assistance in ordering.
To begin this test, press A while in the Diagnostics menu. This test is for the SIO used in the serial data acquisition mode.
Refer to the Diagnostics menu or to the trouble-shooting trees in
for details. Figure 3-21 illustrates the serial SIO
test.
operation: Your probe connection setup should match that in Figure 3-20 before you begin this test. To begin the test,
press START. The LOOP test and DISP ON/OFF functions are available here. The LOOP test has four
features: OFF, I/O, ERROR, and TEST. These can be selected by pressing SELECT even during testing.
DISP can also be selected during testing. If DISP is OFF, no results will appear on the screen other than
results of the I/O LOOP test. To exit this menu, wait until the test finishes, or press STOP, and then press X.
If errors are detected and DISP is ON, some of the following error codes will appear on the screen.
Error codes: B4, B5, B6, B7, B8, B9, BA, BB, BC, BD, BE, BF, CO, C1, C2, C3 (Refer to
Figure 3-20. Probe connection setup for serial test (SER).
Figure 3-21. Display for Serial test (SER).
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Summary of Contents for 318
Page 119: ...318 VERIFICATION AND ADJUSTMENT PROCEDURES ...
Page 182: ...338 VERIFICATION AND ADJUSTMENT PROCEDURES ...
Page 253: ...318 ___________________ TROUBLESHOOTING TREES ...
Page 344: ...338 TROUBLESHOOTING TREES ...
Page 517: ...TM 11 6625 3145 14 318 338 4434 923 318 Block Diagram ...
Page 518: ...TM 11 6625 3145 14 318 338 4434 924 338 Block Diagram ...
Page 519: ...TM 11 6625 3145 14 318 338 4434 925 318 Acquisition Module Wiring Diagram ...
Page 520: ...TM 11 6625 3145 14 318 338 4434 926 318 338 Mainframe Wiring Diagram ...
Page 521: ...TM 11 6625 3145 14 318 338 4434 926 338 Acquisition Module Wiring Diagram ...
Page 522: ...TM 11 6625 3145 14 318 338 4434 928 Figure 9 1 318 A01 Input A Board Component Locations ...
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Page 528: ...TM 11 6625 3145 14 Figure 9 3 318 338 A03 ACQ Control Board Component Locations ...
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Page 542: ...TM 11 6625 3145 14 Figure 9 8 318 338 A10 CRT Board Component Locations ...
Page 544: ...TM 11 6625 3145 14 Figure 9 9 318 338 A11 Inverter Board component Locations ...
Page 546: ...TM 11 6625 3145 14 Figure 9 10 318 338 A12 Regulator Board Component Locations ...
Page 551: ...TM 11 6625 3145 14 Figure 9 12 338 A01 Input A Board Component Locations ...
Page 553: ...TM 11 6625 3145 14 318 338 SERVICE ...
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