TM 11-6625-3145-14
Maintenance: General Information-318/338 Service
Table 6-1
Relative Susceptibility of Semiconductors to Static Discharge Damage
Semiconductor Class
Danger Voltage a
MOS or CMOS
100 -500 V
ECL
200 - 500 V
Schottky signal diodes
250 V
Schottky TTL
500 V
High frequency bipolar transistors
400 - 600 V
JFETs
600 - 800 V
Linear microcircuits
400 - 1000 V
Low-power Schottky TTL
1200 V
a
Voltage discharged from a 100 pF capacitor through a resistance of 100 U.
LITHIUM BATTERY REPLACEMENT
If it is necessary to replace the lithium battery (A07BT1) on the Serial/RS232C/NVM Board, use standard soldering
procedures.
WARNING
To avoid personal injury, observe proper procedures for handling and disposal of lithium
batteries. Improper handling may cause fire, explosion, or severe burns. Don’t recharge, crush,
disassemble, heat the battery above 212° F (100° C), incinerate, or expose contents of the battery
to water. Dispose of battery in accordance with local, state, and national regulations.
PREVENTIVE MAINTENANCE
Preventive maintenance consists of periodic cleaning and inspection. Accumulation of dust on components acts as an
insulating blanket and prevents efficient heat dissipation. This condition can cause overheating and component
breakdown within the instrument. Periodic cleaning and inspection will reduce instrument breakdown and increase
reliability.
This instrument should be cleaned as often as the operating environment requires. A convenient and appropriate time to
perform these procedures is immediately prior to instrument adjustment.
EXTERIOR CLEANING
Dust the exterior surfaces with a dry, lint-free cloth or a soft-bristle brush. If hard dirt remains, use a cloth or swab
dampened with a 5% mild detergent and warm water solution. The swab is also useful for cleaning in narrow spaces
around the controls. Use the detergent solution for cleaning the screen also. Do not use abrasive compounds on any part
of the instrument.
6-3
Summary of Contents for 318
Page 119: ...318 VERIFICATION AND ADJUSTMENT PROCEDURES ...
Page 182: ...338 VERIFICATION AND ADJUSTMENT PROCEDURES ...
Page 253: ...318 ___________________ TROUBLESHOOTING TREES ...
Page 344: ...338 TROUBLESHOOTING TREES ...
Page 517: ...TM 11 6625 3145 14 318 338 4434 923 318 Block Diagram ...
Page 518: ...TM 11 6625 3145 14 318 338 4434 924 338 Block Diagram ...
Page 519: ...TM 11 6625 3145 14 318 338 4434 925 318 Acquisition Module Wiring Diagram ...
Page 520: ...TM 11 6625 3145 14 318 338 4434 926 318 338 Mainframe Wiring Diagram ...
Page 521: ...TM 11 6625 3145 14 318 338 4434 926 338 Acquisition Module Wiring Diagram ...
Page 522: ...TM 11 6625 3145 14 318 338 4434 928 Figure 9 1 318 A01 Input A Board Component Locations ...
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Page 528: ...TM 11 6625 3145 14 Figure 9 3 318 338 A03 ACQ Control Board Component Locations ...
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Page 542: ...TM 11 6625 3145 14 Figure 9 8 318 338 A10 CRT Board Component Locations ...
Page 544: ...TM 11 6625 3145 14 Figure 9 9 318 338 A11 Inverter Board component Locations ...
Page 546: ...TM 11 6625 3145 14 Figure 9 10 318 338 A12 Regulator Board Component Locations ...
Page 551: ...TM 11 6625 3145 14 Figure 9 12 338 A01 Input A Board Component Locations ...
Page 553: ...TM 11 6625 3145 14 318 338 SERVICE ...
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Page 555: ...PIN 058584 ...