TM 11-6625-3145-14
Maintenance: General Information-318/338 Service
LIGHT-EMITTING DIODES (LEDS)
To avoid damage to the LEDs, always keep soldering time and temperature to a minimum. Do not bend the leads or apply
force when inserting the leads into circuit board holes. Clean the circuit board holes of all excess solder before attempting
to install a new LED.
NOTE
Damage to the LEDs may not be immediately apparent. Always follow the
precautionary measures listed above when handling LEDs.
STATIC PRECAUTIONS
CAUTION
Static discharge can damage any semiconductor in this instrument.
This instrument contains electrical components that are susceptible to damage from static discharge. See Table 6-1 for
the relative susceptibility of various classes of semiconductors. Static voltages of 1-30 kV are common in unprotected
environments.
Observe the following precautions to avoid damage:
1.
Minimize handling of static-sensitive components.
2.
Transport and store static-sensitive components or assemblies in their original containers, on a metal rail, or on
conductive foam. Label any package that contains static-sensitive components or assemblies.
3.
Discharge the static voltage from your body by wearing a wrist strap while handling these components. Servicing
static-sensitive assemblies should be performed only in a static-free work station by qualified service personnel.
4.
Nothing capable of generating or holding a static charge should be allowed on the work station surface.
5.
Keep the component leads shorted together whenever possible.
6.
Pick up components by the body, never by the leads.
7.
Do not slide the components over any surface.
8.
Avoid handling components in areas that have a floor or work-surface covering capable of generating a static
charge.
9.
Use a soldering iron that is connected to earth ground.
10.
Use only special anti-static suction type or wick type desoldering tools.
NOTE
Damage to electrical components may not be immediately apparent. Always follow
the precautionary measures listed above when handling static-sensitive
components.
6-2
Summary of Contents for 318
Page 119: ...318 VERIFICATION AND ADJUSTMENT PROCEDURES ...
Page 182: ...338 VERIFICATION AND ADJUSTMENT PROCEDURES ...
Page 253: ...318 ___________________ TROUBLESHOOTING TREES ...
Page 344: ...338 TROUBLESHOOTING TREES ...
Page 517: ...TM 11 6625 3145 14 318 338 4434 923 318 Block Diagram ...
Page 518: ...TM 11 6625 3145 14 318 338 4434 924 338 Block Diagram ...
Page 519: ...TM 11 6625 3145 14 318 338 4434 925 318 Acquisition Module Wiring Diagram ...
Page 520: ...TM 11 6625 3145 14 318 338 4434 926 318 338 Mainframe Wiring Diagram ...
Page 521: ...TM 11 6625 3145 14 318 338 4434 926 338 Acquisition Module Wiring Diagram ...
Page 522: ...TM 11 6625 3145 14 318 338 4434 928 Figure 9 1 318 A01 Input A Board Component Locations ...
Page 526: ...TM 11 6625 3145 14 ...
Page 528: ...TM 11 6625 3145 14 Figure 9 3 318 338 A03 ACQ Control Board Component Locations ...
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Page 542: ...TM 11 6625 3145 14 Figure 9 8 318 338 A10 CRT Board Component Locations ...
Page 544: ...TM 11 6625 3145 14 Figure 9 9 318 338 A11 Inverter Board component Locations ...
Page 546: ...TM 11 6625 3145 14 Figure 9 10 318 338 A12 Regulator Board Component Locations ...
Page 551: ...TM 11 6625 3145 14 Figure 9 12 338 A01 Input A Board Component Locations ...
Page 553: ...TM 11 6625 3145 14 318 338 SERVICE ...
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Page 555: ...PIN 058584 ...