MOD E L 3562A
FAU LT I SO LAT I O N
SECTION VII
FAULT ISOLATION
7-1 INTRODUCTION
This section contains the information req u i red to isolate fai l u res to the circuit board level.
To accomp l ish this, extensive use is made of the power-u p tests and the self-tests. After
isolating the fai l u re to an assembly go to Section VI I I , "Service" to conti nue the fai l u re
isolation process.
The fau lt isolation procedu re assu mes only one independent fai lure. Mu ltiple fai l u res may
cause false resu lts i n the diagnostic tests.
How To Use This Section
Start
Reference
If the d isp lay and soft keys are operative, go to paragraph 7-7, "Test
Al l".
If the i nstru ment is displaying the 'MON ITOR T E ST LOG' or
'PROG RAM ROM DEAD', go to paragraph 7-5, "I nitial Cond itions Test" .
I f there is no display, incorrect disp lay, or the instru ment does not
respond when a key is pressed, go to paragraph 7-5, " I n itial Cond itions
Test".
For chirp and noise source fai l ures, go to paragraph 7-9, "Sou rce
Fai l u res".
For trigger fai l u res, go to paragraph 7-1 1 , " I solating Trigger Failures".
For H P-I B fai l u res, go to paragraph 8-6, ",A,2, ,A,22 System CPU/H PI B",
For interm ittent fai l u res, go to paragraph 7-1 2, " Loop Mode and
For component locators and schematics refer to Section I X .
For the location of cables and boards refer to figure 4-1 in Section IV.
To find a particu lar soft key refer to paragraph 7-1 4,
IISPC L FCTN
Key
Map".
To find the software revision code, refer to part B of paragraph 7-1 5,
"Test Log and Fault Log Descriptions"
To u nderstand the self-d iagnostic process, refer to paragraph 7-1 6,
"Diagnostic Descri ptions".
7-1
Summary of Contents for 3562A
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