ONTRAK Synergy Integra, Руководство по эксплуатации

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C h a p t e r 4 P R O C E S S D E S C R I P T I O N
7/26/00 INTEGRA Operations Revision A 4-5
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
When DI HIGH FLOW activates in an EVENT, a high volume of DI
water injects into the brush core and out through the permeable
brush material. This action flushes the chemical out of the brushes,
returns the pH to the proper level, rinses loosened contamination out
of the brushes, and rinses contamination off the wafer. During a DI
HIGH FLOW, the brushes continue to turn in opposite directions,
cleaning the wafer surfaces as the rollers spin the wafer.
A
NOTE:
DO NOT select DI HIGH FLOW and NH
4
OH at the same time. If both are
selected in the
BRUSH STATION #1 RECIPE
screen, a message displays stating that only
one can be used.
While the system is in the processing mode (START button ON), after the
DI HIGH FLOW portion of the EVENT is complete, the DI LOW FLOW
valve remains OPEN to perform a DI water cleaning process. The wafer
continues in the DI water cleaning process until it transfers to Brush
Station #2. (See “Change EVENT Application Of NH4OH Or HF” on
page 9-10, “Change EVENT Application Of DI HIGH FLOW” on page 9-
11, and “Change EVENT Application Of DI LOW FLOW” on page 9-12.)
E
DGE
C
LEAN
(
OPTION
)
Integra’s roller function is to rotate the wafer so that its axis of rotation
is centered between the two brushes. In addition, Integra’s rollers can
be configured for edge cleaning. Edge cleaning rollers contain a
cleaning pad and turn at a higher speed than the polyurethane drive
roller. This action causes the wafer edge to be scrubbed. Jets of DI water
spray the edge of the wafer and rollers to keep them wet and free of
slurry buildup. Edge clean EVENT ON/OFF times are set in the
Process Recipe screens.
C
LEAN
C
YCLE
T
IMING
When the time set in the Process Recipe for the Brush Station #1
wash cycle completes, the computer checks to see if there is a wafer
in Brush Station #2. If there is a wafer in Brush Station #2, the wafer
in Brush Station #1 continues to undergo a DI water cleaning process
until the Brush Station #2 is clear. If a wafer is not detected, the wafer
in Brush Station #1 transfers to Brush Station #2. (The time setting
procedure is identical for both Brush Stations. (See “Modify Brush #1
Recipe” on page 9-5, reference STEP 2 and STEP 3.)
W
AFER
T
RANSFER
O
UT
When Brush Station #2 is empty, the top brush slows to idle speed and
lifts off of the wafer in Brush Station #1, the rollers retract, and the
conveyor activates to transport the wafer into the Brush Station #2.
As the wafer transfers out of Brush Station #1, a manifold between the
stations sprays DI water to rinse the wafer.