ONTRAK Synergy Integra, Руководство по эксплуатации

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8-4 INTEGRA Operations Revision A 7/26/00
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
24 Check the alignment of the spindle fingers with the spindle in the locked
position. Fingers should always be perpendicular to the back of the carriage.
(The spindle finger arms should be parallel with the carriage transport rollers.)
25 When the spindle is at its TOP position and ready to pass the wafer to the
Output Robot, ensure that the Output Robot arm (paddle) is properly aligned.
The wafer should transfer smoothly between the spin fingers and Output Robot
arm. Check the following variables:
Spin process completes before Output Robot arm moves into Spin Station
exit tunnel.
Output Robot arm moves in, under wafer. Arm is centered between spin
fingers and centered under wafer. Arm must not contact or bump fingers or
wafer. (If spindle position (height) at TOP is adjusted, also adjust Z-Lock.)
Arm moves up to gently contact wafer and vacuum affixes wafer to arm.
Spin fingers open completely. As the spin fingers retract, they should not
“bump” or “scrape” the wafer.
Spindle moves down and out of the way of the wafer and robot arm before
the wafer and robot arm begin to move.
Wafer and robot arm move smoothly out of the Spin Station without
bumping fingers or exit tunnel.
Smooth Wafer Travel Checklist
# VISUAL INSPECTION AREA YES NO