ONTRAK Synergy Integra, Руководство по эксплуатации

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C H A P T E R 3
7/26/00 INTEGRA Operations Revision A 3-1
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
S Y S T E M C O N F I G U R A T I O N
INTRODUCTION
3
The Integra cleaner is designed to clean wafers after various wafer
polishing procedures. System software is at the 2.2.3 level or higher.
Although the Integra is designed for eight inch (200 mm) wafers, six
inch (150 mm) wafers can be run as an option. The following is a
description of the mechanical component activity in each cleaner
station. A more detailed description of the actual wafer cleaning
process is presented in Chapter 4, PROCESS DESCRIPTION.
SYSTEM OPTIONS
The Integra cleaner has several options that are selectable by the
operator.
The ‘System Options’ button in the Main Menu screen is used to
access the system options window. The exact option buttons that are
visible when the window is opened is determined by the
configuration of the machine. Many of the options are generic to all
equipment.
Flat Rotate Enable
This option is only used when the machine is equipped with a Spin
Station stepper motor. The purpose of this motor is to rotate the flat
90 degrees after spin dry so that all the flats are correctly oriented.
This option can be changed at any time.
Maintenance Alarms
If the Maintenance Alarms button is pushed, the maintenance alarm
screen is made visible.
Enable/Disable Brush Motor Alarms
This feature will prevent the system from reporting brush motor (out-
of-spec) speed alarms if enabled. These out-of-spec alarms do not
necessarily impact the proper operation of the cleaner and therefore
the option of disabling these alarms is provided.
First Wafer Clean
This feature is designed to clean the Brush Station brushes prior to the
very first wafer being delivered to the Brush Station from the Input
Station. The reason for this is that if the system has been idle for some
period of time the Brush Station brushes can experience particle build
up. These particles can then transfer to the wafer during cleaning. The
feature is enabled from the SYSTEM OPTIONS screen.