C h a p t e r 9 P R O C E S S R E C I P E
7/26/00
INTEGRA Operations Revision A
9-47
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
41 Enter the desired time in
10
th
of seconds
on the
NUMBER PAD
(not
shown), and touch ENTER.
The
WAFER IDLE TIME
value displays
on the screen in
seconds
.
Use WAFER IDLE TIME to set the idle
time that must expire
before the system initiates the First Wafer Brush Conditioning
procedure.
Brush Station
#2
Cleaning
does not have a separate 1
st
WAFER
IDLE TIME variable.
Change WAFER DOSE TIME
42 The WAFER DOSE TIME (see illustration on following page)
only applies to the
first
wafer if the DOSE MODE is 1
st
WAFER.
If the DOSE MODE is ALL WAFERS, then the set dose time
applies to
every
wafer.
A
NOTE:
If First Wafer Dose is enabled and the process timeout alarm occurs (Alarm #?),
then the cleaner will be put into CLEARING mode. After the alarm timeout period, the
First Wafer Dose for the next wafer may occur BEFORE to cleaner comes out of the
CLEARING mode.
43 Touch WAFER DOSE TIME (see illustration on following page)
for
Brush Station #1 Cleaning
to display the
NUMBER PAD
and
set the dose (duration) time.
STANDARD
Содержание Synergy Integra
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