C h a p t e r 9 P R O C E S S R E C I P E
7/26/00
INTEGRA Operations Revision A
9-25
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
BUTTON NAME & TYPE
DESCRIPTION
COMMENTS
DRIP WAFER COUNT BRUSH CLEANING
DRIP TIME:
Displays the
NUMBER PAD
screen to set/change the
drip time.
Defines the length of time that
processing is halted for the brush
clean procedure. During this time,
NH
4
OH drips onto the top brush.
Works with the DRIP WAFER
COUNT button to set a
specific amount of time that
the brushes are cleaned
without wafers present.
The value on the screen is
shown in
seconds
.
DRIP WAFER COUNT:
Displays the
NUMBER PAD
screen to set/change the
drip wafer count.
Sets the number of wafers that pass
through the Brush Station before
processing is halted so the brushes
can be cleaned.
Works with the DRIP TIME
setting to keep the brushes
clean. See DRIP TIME.
DRIP CHEM:
Toggle ON/OFF (default:
OFF). Sets the DRIP CHEM
ON in the Process Recipe for
a specific Brush Station.
Once the number of wafers in the
DRIP WAFER COUNT occurs,
processing halts, and the DRIP
CHEM flow turns ON/OFF so that
the brushes can be cleaned. Brush
cleaning continues for the time set
in the DRIP TIME.
If the DRIP CHEM, and/or the
DRIP LOW FLOW DI, and/or
the DRIP HI FLOW DI are all
set to ON, then they will all
start at the same time.
DRIP LOW FLOW DI:
Toggle ON/OFF (default: ON).
Sets the DRIP LOW FLOW DI
OFF in the Process Recipe for a
specific Brush Station.
Once the number of wafers in the
DRIP WAFER COUNT occurs,
processing halts, and the DRIP
LOW FLOW turns ON/OFF so
that the brushes can be cleaned.
Brush cleaning continues for the
time set in the DRIP TIME.
If the DRIP CHEM, and/or the
DRIP LOW FLOW DI, and/or
the DRIP HI FLOW DI are all
set to ON, the selected
functions will all start at the
same time.
DRIP HI FLOW DI:
Toggle ON/OFF (default:
OFF). Sets the DRIP HI FLOW
DI ON in the Process Recipe
for a specific Brush Station.
Once the number of wafers in the
DRIP WAFER COUNT occurs,
processing halts, and the DRIP HI
FLOW turns ON/OFF so that the
brushes can be cleaned. Brush
cleaning continues for the time set
in the DRIP TIME.
If the DRIP CHEM, and/or the
DRIP LOW FLOW DI, and/or
the DRIP HI FLOW DI are all
set to ON, the selected
functions will all start at the
same time.
Note 1: All times on the
BRUSH STATION CLEANING DEFINE SCREEN
are displayed in seconds, HOWEVER,
all times are entered in the
NUMBER PAD
screen in
10
th
of seconds
. For example, if the desired event time is
3.2 seconds, it is entered as 32. No decimal point is used!
Содержание Synergy Integra
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