ONTRAK Synergy Integra, Руководство по эксплуатации, Страница: 54 / 350

3-16 INTEGRA Operations Revision A 7/26/00
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
BRUSH STATION #2
G
ENERAL
D
ESCRIPTION
Brush Station #2 operates similarly to Brush Station #1. The same
type of conveyor operates to transport the wafers into and out of the
station. Brush Station #2 has the same brush configuration and the
same roller operation.
P
ROCESS
S
OLUTION
D
RIP
: NH
4
OH (O
PTIONAL
C
ONFIGURATION
)
If NH
4
OH is to be used in Brush Station #2, the chemical dispense
drawer for NH
4
OH must be installed to service Brush Station #2. The
Process Key is set to STANDARD, the system Process Recipe screen
for Brush Station #2 is set to include NH
4
OH. The process solution
(ammonium hydroxide) flows to the Brush Station drip manifold,
and is controlled by a flow regulator. The process solution drip line
deposits a dilute solution of NH
4
OH onto the brushes, to improve
the wafer cleaning process.
In the NH
4
OH drip configuration, HF is not used.
P
ROCESS
S
OLUTION
I
NJECTION
: HF (P
RIMARY
S
YSTEM
C
ONFIGURATION
)
Brush Station #2 brushes are normally plumbed for the injection of
Hydrofluoric Acid through the brushes. When the Process Key is set
to HF2, the system Process Recipe screen is set to include the HF
dispense option. In this system configuration, the dilute HF can be
injected through the permeable brush membrane onto the wafer
surfaces, to etch away a small amount of the film deposited on the
wafer. The amount of time that the HF is flowing through the
brushes is set in the Process Recipe screen for Brush Station #2.
Z
DANGER! CHEMICAL HAZARD:
Operators and technicians must become
familiar with the potential hazards associated with the chemicals used in the system. A
Materials Safety Data Sheet (MSDS) for the chemicals used should be present near the
area of use.
E
XIT
S
PRAY
There is no Brush Station #2 entrance spray because the wafer is
sprayed by the Brush Station #1 exit spray. Brush Station #2 does
have an exit spray. A manifold extending across the exit, sprays DI
water on the exiting wafer to rinse off any loosened contaminates.
E
DGE
C
LEAN
(
OPTION
)
The optional edge cleaning process is identical in both Brush Stations
with the addition of a spray shield in Brush Station #2 to protect the
Spin Station dry process from overspray.