ONTRAK Synergy Integra, Руководство по эксплуатации

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4-6 INTEGRA Operations Revision A 7/26/00
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
P
ROCESS
I
DLE
T
IME
The Integra system is designed to operate 24 hours a day, 7 days a
week. However, occasional process delays may occur (e.g., no wafers
to process) which can leave the Integra system operating in the
processing mode, but idle for a period of time. When idle for
extended periods of time, the brushes must be protected from
developing contamination and properly reconditioned before
resuming wafer processing. The Integra provides several
programmable process idle time brush conditioning variables which
are set in the
BRUSH STATION DEFINE CLEANING SCREEN
.
The first variables that can be set are the
IDLE TIME PURGES
. An idle
time purge dispenses TTB chemistries to the top brush followed by a
dispense of DI water via the
DI HIGH FLOW
. After a set period of
time (variable), the
IDLE TIME PURGES
cycles the dispense of process
solution and DI water ON for a set period time (variable) and OFF
for a set period of time (variable). This ON/OFF cycling is repeated
until the system is ready to begin processing. See “Change Idle Time
Brush Cleaning Interval” on page 9-35.
A
NOTE:
If the system has been inactive for a significant period of time, the computer
checks the elapsed time since the last time a wafer entered Brush Station #1. If the
length of time elapsed exceeds the programmed time limit, set in the BRUSH IDLE
TIMER, will drip process chemical on the brushes for the length of time set in CLEAN
ON TIME.