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4-8 INTEGRA Operations Revision A 7/26/00
20-0200-231 (CR), 20-0200-232 (Std), 20-0200-251 (CD)
BRUSH STATION #2
W
AFER
T
RANSFER
I
N
4
As the wafer transfers from Brush Station #1 to Brush Station #2, it is
rinsed with DI water. A fiber optic emitter/receiver sensor, located
between Brush Station #1 and Brush Station #2, detects the wafer.
(See “WAFER SENSOR” on page 3-11, in the sensor table.) The top
brush initially raises as part of the station reset and is up as the wafer
enters the station. Also as part of the station reset, the rollers are
closed to a pre programmed position according to wafer size. The
upper brush remains up until the wafer reaches the rollers, then the
top brush moves down into place. The upper and lower brushes turn
in opposite directions in such a way that they facilitate the wafer
movement in the same direction as the conveyor track. Because the
top and bottom brushes turn in opposite directions, they exert
constant pressure on the wafer and guide it into the rollers.
W
AFER
C
ENTERING
The positioning of the rollers in combination with the continual
forward pressure exerted by the brushes, centers the wafer between
the brushes. Roller heights are set so that the wafer is in correct contact
with them, its horizontal position is adjusted slightly so that no part of
the wafer touches the conveyor track while the wafer is being cleaned.
W
AFER
C
LEANING
Introduction
The wafer cleaning process used in Brush Station #2 contains
variables which may be programmed using the Process Recipe. Each
cleaning cycle has three programmable
EVENTS
consisting of six
variables. The variables are of two types:
1 ON/OFF options for chemical dispense (NH
4
OH or HF
depending on the station configuration),
DI HIGH FLOW
and
DI
LOW FLOW
.
2 Variable setting options for
TIME
,
ROLLER SPEED
, and
BRUSH
SPEED
.
In addition to the three EVENTS, there are also four independent
EVENT settings that must be define for the Brush #2 Process Recipe.
For more information see “Modify Brush #1 Recipe” on page 9-5
and“Modify Brush #2 Recipe” on page 9-21.
Depending on the system hardware setup, Brush Station #2 can
process wafers using hydrofluoric acid HF or NH
4
OH. HF is
standard in Brush Station #2 and NH
4
OH is optional. See “Wafer
Cleaning” on page 4-3 for further information on the NH
4
OH
cleaning process.