Removing a heat-sink retention module
Use this information to remove a heat-sink retention module.
Before you begin
Read the safety information in “Safety” on page vii and “Installation guidelines”
on page 34.
If you are replacing a component or installing an optional device in the server, you
need to turn off the server and peripheral devices, and disconnect the power cords
and all external cables.
About this task
To remove a heat-sink retention module, complete the following steps.
Procedure
1.
Carefully turn the server on its side so that it is lying flat, with the cover facing
up.
Attention:
Do not allow the server to fall over.
2.
Unlock and remove the left-side cover (see “Removing the left-side cover” on
page 39).
3.
Remove the air baffle (see “Removing the air baffle” on page 210).
4.
Remove the heat sink (see “Removing a microprocessor and heat sink” on page
315).
Note:
When you remove a microprocessor and heat sink, be sure to keep each
heat sink with its microprocessor for reinstallation.
5.
Use a screwdriver and remove the four screws that secure the retention module
to the system board; then, lift the retention module from the system board.
What to do next
If you are instructed to return the component or optional device, follow all
packaging instructions, and use any packaging materials for shipping that are
supplied to you.
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