Diagnostics provides monitoring functions which run automatically while the plant is in use.
This increases plant availability by reducing commissioning times and down times.
Distributed I/O systems
These are input/output units that are not located in the base unit; instead, they are distributed
at some distance from the CPU, e.g.:
● ET 200M, ET 200X, ET 200L, ET 200S, ET 200iSP
● DP/AS-I link
● Other DP slaves from Siemens or other vendors
The distributed I/O systems are connected to the DP master via PROFIBUS DP.
DP master
A master that complies with the
IEC 61784–1:2002 Ed1 CP 3/1 standard is known as a DP
master.
DP slave
A slave running on the PROFIBUS using the PROFIBUS DP protocol in accordance with
IEC
61784-1:2002 Ed1 CP 3/1 is known as a DP slave.
DP standard
The DP standard is the bus protocol of the ET 200 distributed I/O system in accordance with
IEC 61784-1:2002 Ed1 CP 3/1.
DPV1
An enhanced version of the original PROFIBUS standard
IEC 61784-1:2002 Ed1 CP 3/1.
Equipotential bonding
Electrical connection (equipotential bonding conductor) that keeps electrical equipment and
extraneous conductive objects at the same or roughly identical potential in order to prevent
disturbing or dangerous voltages between these objects.
ET 200
The ET 200 distributed I/O system with PROFIBUS DP protocol allows the connection of
distributed I/Os to a CPU or suitable DP master. The ET 200 system is characterized by its
fast response times since very little data (few bytes) are transferred.
ET 200 is based on
IEC 61784–1:2002 Ed1 CP 3/1.
The ET 200 works on the master/slave principle. Examples of DP masters are the IM308-C
master interface or the CPU 315-2 DP.
Glossary
ET 200iSP
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Operating Instructions, 11/2017, A5E00247483-07