MAP 0280: 604 or 604e High Node Minimum Configuration
027 (continued)
The number ‘888’ or ‘---’ is in the operator panel display.
Is ‘Diagnostic Operating Screen’ or ‘c31’ displayed in the operator panel display?
Yes No
028
– Repeat Step 019 on page 1-151 until the defective device is identified or all the devices and
cables have been exchanged.
– If all the devices and cables have been removed then, one of the FRUs remaining in the CPU
Enclosure is defective. To test each FRU, exchange the FRUs in the following order:
Adapter (last one installed)
I/O card (IOD)
I/O planars
CPU module flex cables
I/O module flex cables
System interface board (SIB)
Power supply (PS)
Did the symptom change?
Yes No
029
– Call the next level of support.
030
– Check for loose cards, cables, and obvious problems. If you do not find a problem, return to Step
001 on page 1-146 and follow the instructions for the new symptom.
031
The last device or cable you disconnected is defective.
– Exchange the defective device or cable.
– Go to “MAP 0570: End of Call” on page 1-357.
032
– Set the circuit breakers to the Off (‘0’) position.
– Record the slot numbers of the adapters. Label and record the location of any cables attached to the
adapters. Remove all the MCA adapters except the one that is attached to hdisk0 that you will IPL from
and the one that your console is attached to.
Note: Leave serial adapter cable and supervisor adapter cable attached.
– Set the circuit breakers to the On (‘1’) position.
– Perform service diagnostics from either hdisk0 or network book.
– If the Maintenance Menu is displayed, select System Boot, then Boot From List.
– Wait for one of the following conditions to occur:
The system stops with ‘c31’ displayed in the operator panel display.
The system stops with a flashing or solid ‘269’ displayed in the operator panel display.
The same three digit number is displayed in the operator panel display for longer than three minutes
except for the number ‘165’ which may display for up to ten minutes with no activity on the BUMP
console.
(Step 032 continues)
Chapter 1. Maintenance Analysis Procedures (MAPs)
1-153
Summary of Contents for RS/6000 SP
Page 1: ...RS 6000 SP IBM Maintenance Information Volume 2 Maintenance Analysis Procedures GA22 7376 01...
Page 2: ......
Page 3: ...RS 6000 SP IBM Maintenance Information Volume 2 Maintenance Analysis Procedures GA22 7376 01...
Page 8: ...vi RS 6000 SP MAPs...
Page 10: ...viii RS 6000 SP MAPs...
Page 16: ...xiv RS 6000 SP MAPs...
Page 20: ...xviii RS 6000 SP MAPs...
Page 60: ...MAP 0130 Processor Node Figure 1 7 Thin Node High Level Diagram 1 40 RS 6000 SP MAPs...
Page 383: ......
Page 387: ......