Environmental Data Sheet
Page 2
Declared Noise Emissions in accordance with ISO 9296
Service Level
Sound Power
(L
WAd
, bels)
(1 bel=10 decibels, re
10
-12
Watts)
Sound Pressure Operator
Position
(L
pAm
, decibels)
(re 2x10
-5
Pa)
Sound Pressure Bystander
Position
(L
pAm
, decibels)
(re 2x10
-5
Pa)
Floppy Drive
Accessing
4.8 40 35
Hard Drive Accessing
3.6
32
27
CD Drive Accessing
5.1
43
37
Idle 3.7
27
22
PRODUCT MATERIALS INFORMATION
4
Restricted Substances
This Dell product does
NOT
contain any of the following substances (in concentrations exceeding legal threshold limits):
•
Asbestos
•
Azo dyes/colorants in components that come into direct contact with human skin
•
Cadmium and its compounds (except for use in applications exempted by the EU RoHS Directive)
•
Class I and Class II CFCs (chlorofluorocarbons) and HCFCs (hydrofluorocarbons)
•
Chloroparaffins, short chained (10-13 carbon chain)
•
Chromium VI and its compounds (except for use in applications exempted by the EU RoHS Directive)
•
Halogenated dioxins or furans (i.e. polychlorinated dibenzodioxines, polychlorinated dibenzofurans)
•
Lead and its compounds (except for use in applications exempted by the EU RoHS Directive)
•
Mercury (except for use in applications exempted by the EU RoHS Directive)
•
Nickel and its compounds in components that are likely to result in prolonged skin exposure
•
PCBs (polychlorobiphenyls) or PCTs (polychloroterphenyls)
•
PBBs (polybromobiphenyls) or PBDEs (polybrominated diphenylethers)
•
PVC (polyvinyl chloride) in plastic parts greater than 25 grams
•
Polychlorinated naphthalenes (PCNs)
•
Tributyl tin (TBT) and triphenyl tin (TPT) compounds
For information on Japan RoHS (J-MOSS) chemical disclosures:
www.dell.com/japan_rohs
.
Additional Materials Information
•
The cables may use PVC as an insulating material to ensure product safety
•
The case material is
PC+ABS and sheet metal
•
Product may contain post-industrial recycled content (plastics, metal, glass)
Flame Retardants Used in Mechanical Plastic Parts > 25 grams, Keycaps, and Motherboards
Part
Flame Retardant
ISO 1043-
4
Motherboard TBBPA
FR(16)
Mechanical Plastic Parts > 25 grams PC+ABS,
PC-GF
Triaryl phosphate ester
FR(40)
Mechanical Plastic Parts > 25 grams
N/A
N/A
Packaging
No CFCs (chlorofluorocarbons), HCFCs (hydrofluorocarbons) or other ozone depleting substances are used in packaging material.
4
Waste Handling.
Local regulations should be observed when disposing of this product due to the presence of the materials and substances as listed above.
Содержание Dektak 150
Страница 1: ......
Страница 2: ...P N 980 294 Standard P N 980 298 Cleanroom Revision A DEKTAK 150 SURFACE PROFILER USER S MANUAL ...
Страница 7: ......
Страница 17: ......
Страница 81: ......
Страница 105: ......
Страница 149: ......
Страница 191: ......
Страница 251: ......
Страница 257: ...A 6 Facilities Specifications Figure A 6 Dektak 150 without Enclosure Side View ...
Страница 258: ...Facilities Specifications A 7 Figure A 7 Dektak 150 Dimensions without Enclosure Top View ...
Страница 259: ...A 8 Facilities Specifications Figure A 8 Dektak 150 without Enclosure Center of Mass ...
Страница 273: ......
Страница 283: ......
Страница 320: ...3D Mapping Function E 37 Figure E 26 Database Options Button Figure E 27 Database Options Dialog Box ...
Страница 321: ......
Страница 331: ......
Страница 333: ......
Страница 336: ......
Страница 337: ......
Страница 349: ......