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User’s Manual U14492EJ3V0UD
CHAPTER 20 RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
Table 20-1. Surface Mounting Type Soldering Conditions
µµµµ
PD703116GJ-xxx-UEN:
144-pin plastic LQFP (fine pitch) (20
××××
20)
µµµµ
PD703116GJ(A)-xxx-UEN:
144-pin plastic LQFP (fine pitch) (20
××××
20)
µµµµ
PD703116GJ(A1)-xxx-UEN: 144-pin plastic LQFP (fine pitch) (20
××××
20)
µµµµ
PD70F3116GJ-UEN:
144-pin plastic LQFP (fine pitch) (20
××××
20)
µµµµ
PD70F3116GJ(A)-UEN:
144-pin plastic LQFP (fine pitch) (20
××××
20)
µµµµ
PD70F3116GJ(A1)-UEN:
144-pin plastic LQFP (fine pitch) (20
××××
20)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 230°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less, Exposure limit: 3 days
Note
(after that, prebake at 125°C for
10 hours)
IR30-103-2
VPS
Package peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or higher),
Count: Two times or less, Exposure limit: 3 days
Note
(after that, prebake at 125°C for
10 to 72 hours)
VP15-103-2
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together.
Содержание V850E/IA1 mPD703116
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