166
Virtex-4 QV FPGA Ceramic Packaging
UG496 (v1.1) June 8, 2012
Chapter 3: Pinout Diagrams
R
CF1509 Package Pinout Diagram (LX200)
X-Ref Target - Figure 3-5
Figure 3-5:
CF1509 Flip-Chip Fine-Pitch BGA Composite Pinout Diagram (LX200)
H
C
N
Y
U
M
S
S
S
CF1509 (XQR4VLX200) − Top View
UG496_C0
3
_05_04020
8
1
2
3
4
5
6
7
8
9
10
11
12
1
3
14
15
16
17
1
8
19
20
21
22
2
3
24
25
26
27
2
8
29
3
0
3
1
3
2
33
3
4
3
5
3
6
3
7
38
3
9
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
1
2
3
4
5
6
7
8
9
10
11
12
1
3
14
15
16
17
1
8
19
20
21
22
2
3
24
25
26
27
2
8
29
3
0
3
1
3
2
33
3
4
3
5
3
6
3
7
38
3
9
P
B
D
2
W
0
O
K
1
A
I
S
S
S
C CCLK
ADC
P PROGRAM_B
D DONE
0
1
2
M2, M1, M0
H
Y
U
H
S
WAPEN
K TCK
I
TDI
O TDO
M TM
S
W PWRDWN_B
N
D0 - D
3
1
A
B
R R
S
VD
GND
VBATT
VCCINT
VCCAUX
S S
M
VCCO
IO_LXXY_#
P_GC
N_GC
CC
VRP
VRN
VREF
U
s
er I/O Pin
s
S
M1 -
S
M7
ADC1 - ADC7
D_IN
C
S
_B
RDWR_B
DOUT_BU
S
Y
INIT
M
u
lti-F
u
nction Pin
s
:
NO CONNECT
n
Dedicated Pin
s
Other Pin
s
LC
Z
Z
Z
Z
Z
Z
Z
Note
s
: 1.
S
M
a
nd ADC f
u
nction
a
lity in m
u
lti-f
u
nction
us
er I/O pin
s
i
s
re
s
erved for f
u
t
u
re
us
e.
2. Dedic
a
ted
S
M
a
nd ADC pin
s
a
re re
s
erved for f
u
t
u
re
us
e.
J
J
TDP
L
L
TDN