Virtex-4 QV FPGA Ceramic Packaging
77
UG496 (v1.1) June 8, 2012
CF1144 (FX60) Ceramic Flip-Chip Column Grid Package
R
N/A
VCCINT
W12
N/A
VCCINT
P13
N/A
VCCINT
T13
N/A
VCCINT
V13
N/A
VCCINT
Y13
N/A
VCCINT
N14
N/A
VCCINT
R14
N/A
VCCINT
U14
N/A
VCCINT
W14
N/A
VCCINT
AC14
N/A
VCCINT
M15
N/A
VCCINT
P15
N/A
VCCINT
T15
N/A
VCCINT
V15
N/A
VCCINT
AB15
N/A
VCCINT
AD15
N/A
VCCINT
N16
N/A
VCCINT
R16
N/A
VCCINT
W16
N/A
VCCINT
AC16
N/A
VCCINT
M17
N/A
VCCINT
P17
N/A
VCCINT
V17
N/A
VCCINT
Y17
N/A
VCCINT
AB17
N/A
VCCINT
AD17
N/A
VCCINT
L18
N/A
VCCINT
N18
N/A
VCCINT
R18
N/A
VCCINT
U18
N/A
VCCINT
AA18
N/A
VCCINT
AC18
N/A
VCCINT
M19
N/A
VCCINT
T19
N/A
VCCINT
Y19
N/A
VCCINT
AB19
N/A
VCCINT
L20
N/A
VCCINT
N20
Table 2-2:
CF1144 Package(FX60) (Cont’d)
Bank
Pin Description
Pin
Number
No Connects