Virtex-4 QV FPGA Ceramic Packaging
117
UG496 (v1.1) June 8, 2012
CF1509 (FX140) Ceramic Flip-Chip Column Grid Package
R
N/A
VCCAUX
AL33
N/A
VCCINT
AB6
N/A
VCCINT
AF6
N/A
VCCINT
V8
N/A
VCCINT
L9
N/A
VCCINT
L11
N/A
VCCINT
AE11
N/A
VCCINT
AG11
N/A
VCCINT
M12
N/A
VCCINT
AD12
N/A
VCCINT
AF12
N/A
VCCINT
L13
N/A
VCCINT
N13
N/A
VCCINT
R13
N/A
VCCINT
U13
N/A
VCCINT
AE13
N/A
VCCINT
AG13
N/A
VCCINT
K14
N/A
VCCINT
M14
N/A
VCCINT
P14
N/A
VCCINT
T14
N/A
VCCINT
AD14
N/A
VCCINT
AF14
N/A
VCCINT
L15
N/A
VCCINT
N15
N/A
VCCINT
R15
N/A
VCCINT
AA15
N/A
VCCINT
AC15
N/A
VCCINT
AE15
N/A
VCCINT
AG15
N/A
VCCINT
AJ15
N/A
VCCINT
P16
N/A
VCCINT
T16
N/A
VCCINT
AD16
N/A
VCCINT
AF16
N/A
VCCINT
N17
N/A
VCCINT
R17
N/A
VCCINT
U17
Table 2-3:
FF1517 Package Pinout (FX140) (Cont’d)
Bank
Pin Description
Pin Number
No Connects