Virtex-4 QV FPGA Ceramic Packaging
157
UG496 (v1.1) June 8, 2012
CF1509 (LX200) Ceramic Flip-Chip Column Grid Package
R
N/A
VCCINT
V8
N/A
VCCINT
AH8
N/A
VCCINT
AM8
N/A
VCCINT
N9
N/A
VCCINT
AA9
N/A
VCCINT
F10
N/A
VCCINT
T10
N/A
VCCINT
AD10
N/A
VCCINT
AP10
N/A
VCCINT
J11
N/A
VCCINT
W11
N/A
VCCINT
AG11
N/A
VCCINT
M12
N/A
VCCINT
AB12
N/A
VCCINT
AD12
N/A
VCCINT
AH12
N/A
VCCINT
AK12
N/A
VCCINT
L13
N/A
VCCINT
N13
N/A
VCCINT
R13
N/A
VCCINT
AE13
N/A
VCCINT
AG13
N/A
VCCINT
AN13
N/A
VCCINT
H14
N/A
VCCINT
K14
N/A
VCCINT
M14
N/A
VCCINT
P14
N/A
VCCINT
V14
N/A
VCCINT
Y14
N/A
VCCINT
AD14
N/A
VCCINT
AF14
N/A
VCCINT
AH14
N/A
VCCINT
AK14
N/A
VCCINT
L15
N/A
VCCINT
N15
N/A
VCCINT
U15
N/A
VCCINT
W15
N/A
VCCINT
AA15
Table 2-4:
CF1509 Package Pinout (LX200) (Cont’d)
Bank
Pin Description
Pin Number
No Connect