IBM System x iDataPlex dx360 M2, Руководство по диагностике и обслуживанию, Страница: 214 / 264

Notes:
v The heat-sink FRU is packaged with the thermal material applied to the
underside.
v
You must replace the thermal material if it becomes contaminated or has come in
contact with another object other than its paired microprocessor.
v
The heat sink and the thermal material are available as separate FRUs.
To remove a microprocessor and heat sink, complete the following steps.
1. Read the safety information that begins on page vii and “Installation guidelines”
on page 123.
2. If the system-board tray is installed in a chassis, remove it (see “Removing the
system-board tray from a 2U chassis” on page 126 or “Removing the
system-board tray from a 3U chassis” on page 128).
3. If an expansion enclosure is installed, remove it (see “Removing an expansion
enclosure from a system-board tray” on page 131); otherwise, remove the
system-board tray cover (see “Removing the system-board tray cover” on page
125).
4. Remove the heat sink.
Attention: Do not touch the thermal material on the bottom of the heat sink.
Touching the thermal material will contaminate it. If the thermal material on the
microprocessor or heat sink becomes contaminated, you must replace it.
a. Loosen the screw on one side of the heat sink to break the seal with the
microprocessor.
b. Press firmly on the captive screws and loosen them with a screwdriver.
c. Use your fingers to gently pull the heat sink off the microprocessor.
d. Pull the thermal sensor clip off the heat sink; then, place the heat sink
upside down on a clean, flat surface.
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System x iDataPlex dx360 M2: Problem Determination and Service Guide