Appendix 1
Appendix 1-3
Ver.0.10
MECHANICAL SPECIFICATIONS
Appendix 1.1 Dimensional Outline Drawing
(2) 255-pin FBGA
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Weight(g)
—
—
JEDEC Code
EIAJ Package Code
255F7F
255pin 17
×
17mm body FBGA
0.8
×
19=15.2
A
0.8TYP
17TYP
0.8
×
19=15.2
0.8TYP
B
1.2MAX
C
0.1
C
0.35–0.05
(16.6)
17TYP
(16.6)
0.20
C
B
0.2
✕
4
255-
φ
0.45–0.05
φ
0.08
C
M
AB
Under Development
0.20 C A
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Recommended Mount Pad 255FBGA
Note : 255FBGA is currently under development.
0.32mm
0.3mm
Metal wiring
(Cu pattern)
Ni/Au plating
via
Solder
resist
Cu pattern
[P.C.B.side]
[Package side]
Summary of Contents for M32170F3VFP
Page 42: ...1 1 24 Ver 0 10 OVERVIEW 1 4 Pin Layout This is a blank page ...
Page 56: ...2 2 14 Ver 0 10 This is a blank page ...
Page 88: ...3 3 32 Ver 0 10 ADDRESS SPACE 3 7 Notes on Address Space This is a blank page ...
Page 270: ...9 9 40 Ver 0 10 DMAC 9 4 Precautions about the DMAC This is a blank page ...
Page 614: ...12 12 64 Ver 0 10 This is a blank page SERIAL I O 12 9 Precautions on Using UART Mode ...
Page 756: ...17 17 10 Ver 0 10 RAM BACKUP MODE 17 4 Exiting RAM Backup Mode Wakeup This is a blank page ...
Page 762: ...18 18 6 Ver 0 10 OSCILLATION CIRCUIT 18 2 Clock Generator Circuit This is a blank page ...
Page 831: ...CHAPTER 22 CHAPTER 22 TYPICAL CHARACTERISTICS 22 1 A D Conversion Characteristics ...
Page 833: ...Appendix 1 1 Dimensional Outline Drawing APPENDIX 1 APPENDIX 1 MECHANICAL SPECIFICATIONS ...
Page 841: ...Appendix 3 1 Precautions about Noise APPENDIX 3 APPENDIX 3 PRECAUTIONS ABOUT NOISE ...