LSI LSI53C1000, Technical Manual

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3-16 Signal Descriptions
3.8 Power and Ground Signals
Table 3.14 describes the Power and Ground Signal group.
Table 3.14 Power and Ground Signals
Name
1
Bump Type Strength Description
V
SS_IO
C3, C21, D4, D12, D20,
K10–14, L10–14, M4, M10–14,
M20, N10–14, P10–14, Y4,
Y12, Y20, AA3, AA21 G N/A Ground for PCI bus
drivers/receivers, SCSI bus
drivers/receivers, local memory
interface drivers, and other I/O
pins.
V
DD_IO
D7, D10, D14, D17, G4, G20,
K4, K20, P4, P20, U4, U20,
Y7, Y10, Y14, Y17 P N/A Power for PCI bus
drivers/receivers, SCSI bus
drivers/receivers, local memory
interface drivers/receivers, and
other I/O pins.
V
DD
_CORE B22, B23, D3, E4, Y13, AB3,
AB18, AB23, AC1
P N/A Power for core logic.
V
SS
_CORE A22, D2, D21, F3, Y15, AA22,
AB19, AB2, AC2, AC21 G N/A Ground for core logic.
V
DD
_A
2
B2, C20 P N/A Power for analog cells (clock
quadrupler and DIFFSENS logic).
V
SS
_A
2
B20, C2 G N/A Ground for analog cells (clock
quadrupler and DIFFSENS logic).
V
DD
_Bias A11, M22 P N/A Power for the RBIAS circuit.
RBIAS M21 I N/A Used to connect an external
resistor to generate the bias
current used by LVDlink pads.
Resistor value should be 10.0 k
Ω
.
Connect the other end of the
resistor to V
DD
.