3 General Safety Precautions and Usage Considerations
3-13
(1)
Using a soldering iron
Complete soldering within ten seconds for lead temperatures of up to 260°C, or within three
seconds for lead temperatures of up to 350°C.
(2)
Using medium infrared ray reflow
•
Heating top and bottom with long or medium infrared rays is recommended (see Figure 3).
Long infrared ray heater (preheating)
Medium infrared ray heater
(reflow)
Product flow
Figure 3 Heating top and bottom with long or medium infrared rays
•
Complete the infrared ray reflow process within 30 seconds at a package surface temperature of
between 210°C and 240°C.
•
Refer to Figure 4 for an example of a good temperature profile for infrared or hot air reflow.
210
30 s
or less
Time (s)
60-120 s
(°C)
240
160
140
P
ack
age surface tem
perature
Figure 4 Sample temperature profile for infrared or hot air reflow
(3)
Using hot air reflow
•
Complete hot air reflow within 30 seconds at a package surface temperature of between 210°C
and 240°C.
•
For an example of a recommended temperature profile, refer to Figure 4 above.
(4)
Using solder flow
•
Apply preheating for 60 to 120 seconds at a temperature of 150°C.
•
For lead insertion-type packages, complete solder flow within 10 seconds with the
temperature at the stopper (or, if there is no stopper, at a location more than 1.5 mm from
the body) which does not exceed 260°C.
Summary of Contents for TMPR7901
Page 1: ...TX System RISC TX79 Family TMPR7901 Symmetric 2 way superscalar 64 bit CPU ...
Page 14: ...Handling Precautions ...
Page 15: ......
Page 17: ...1 Using Toshiba Semiconductors Safely 1 2 ...
Page 41: ...4 Precautions and Usage Considerations 4 2 ...
Page 42: ...TX7901 User s Manual Rev 6 30T November 2001 DOCUMENT NUMBER M 99 00004 07 ...
Page 43: ......
Page 259: ...Chapter 13 Removed TX7901 User s Manual Rev 6 30T Nov 2001 13 1 13 Removed ...
Page 260: ...Chapter 13 Removed TX7901 User s Manual Rev 6 30T Nov 2001 13 2 ...