2 Safety Precautions
2-3
2.2
Precautions Specific to Each Product Group
2.2.1 Optical
semiconductor
devices
When a visible semiconductor laser is operating, do not look directly into the laser beam or look through the optical system.
This is highly likely to impair vision, and in the worst case may cause blindness.
If it is necessary to examine the laser apparatus, for example to inspect its optical characteristics, always wear the appropriate
type of laser protective glasses as stipulated by IEC standard IEC825-1.
Ensure that the current flowing in an LED device does not exceed the device’s maximum rated current.
This is particularly important for resin-packaged LED devices, as excessive current may cause the package resin to blow up,
scattering resin fragments and causing injury.
When testing the dielectric strength of a photocoupler, use testing equipment which can shut off the supply voltage to the
photocoupler. If you detect a leakage current of more than 100
µ
A, use the testing equipment to shut off the photocoupler’s
supply voltage; otherwise a large short-circuit current will flow continuously, and the device may break down or burst into flames,
resulting in fire or injury.
When incorporating a visible semiconductor laser into a design, use the device’s internal photodetector or a separate
photodetector to stabilize the laser’s radiant power so as to ensure that laser beams exceeding the laser’s rated radiant power
cannot be emitted.
If this stabilizing mechanism does not work and the rated radiant power is exceeded, the device may break down or the
excessively powerful laser beams may cause injury.
2.2.2 Power
devices
Never touch a power device while it is powered on. Also, after turning off a power device, do not touch it until it has thoroughly
discharged all remaining electrical charge.
Touching a power device while it is powered on or still charged could cause a severe electric shock, resulting in death or serious
injury.
When conducting any kind of evaluation, inspection or testing, be sure to connect the testing equipment’s electrodes or probes to
the device under test before powering it on.
When you have finished, discharge any electrical charge remaining in the device.
Connecting the electrodes or probes of testing equipment to a device while it is powered on may result in electric shock, causing
injury.
Summary of Contents for TMPR7901
Page 1: ...TX System RISC TX79 Family TMPR7901 Symmetric 2 way superscalar 64 bit CPU ...
Page 14: ...Handling Precautions ...
Page 15: ......
Page 17: ...1 Using Toshiba Semiconductors Safely 1 2 ...
Page 41: ...4 Precautions and Usage Considerations 4 2 ...
Page 42: ...TX7901 User s Manual Rev 6 30T November 2001 DOCUMENT NUMBER M 99 00004 07 ...
Page 43: ......
Page 259: ...Chapter 13 Removed TX7901 User s Manual Rev 6 30T Nov 2001 13 1 13 Removed ...
Page 260: ...Chapter 13 Removed TX7901 User s Manual Rev 6 30T Nov 2001 13 2 ...