NOVA electronics Inc. MCX514 -
261
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261
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13. Storage and Recommended Installation Conditions
13.1
Storage of this IC
Note the following items in regard to the storage of this IC.
(1) Do not throw or drop the IC. Otherwise, the packing material could be torn, damaging the airtightness.
(2) Store the IC sealed damp-proof package in the temperature 30°C or lower and humidity 85%RH or lower and use the IC within
12 months.
(3) If the IC usage date has expired, remove any dampness by baking it at the temperature 125°C
±
5°C for 20 hours or more and
36 hours or less. The number of baking must not exceed two times. If damp-proofing is damaged before expiration, also apply
damp removal processing.
(4) Protect the device from static electricity before applying damp removal processing.
(5) After opening the damp-proof package, store the IC in the temperature 30°C or lower and humidity 70%RH or lower, and
install it within seven days. If the allowable storage period described above has been exceeded, baking must be applied before
installation of the IC.
13.2
Standard Installation Conditions by Soldering Iron
The standard installation conditions for the IC by soldering iron are as follows.
(1) Installation method:
Soldering iron (heating pin section)
(2) Installation conditions: The temperature of the pin: 350°C or lower, Time: 5 seconds or less, Number of times: 2 times or less
13.3
Standard Installation Conditions by Solder Reflow
The standard installation conditions for the IC by solder reflow are as follows.
Time (second)
250
220
200
140
60
～
120seconds
Max60seconds
Preheating
P
a
c
k
a
g
e
S
u
rf
a
c
e
T
e
m
p
e
ra
tu
re
(
℃
)
Main
heating
Max10
seconds
Time of 140
℃～
200
℃
(Preheating temperature)
Solder reflow count
Time of over 250
℃
Maximum reflow temperature (package surface temperature)
260
℃
or less
10 seconds or less
60
～
120 seconds
Up to twice
260
Time of over 220
℃
60 seconds or less
Mounting Method
(1)
Infrared
(2)
Hot air
(3) I
nfrared and Hot air
MCX514 Standard Soldering Reflow Heat-proof Profile
