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Drive
Backplane
Processor
Model
Heat Sink
Drive and
Memory
Configuratio
n
Max. Air
Inlet
Temperature
Intel
®
Xeon
®
Scalable
(Skylake and
Cascade Lake)
processor (P ≤
165 W)
Narrow
conjoined
heat sinks
● Drives ≤ 24
● DIMMs ≤
16
35°C (95°F)
Wide
conjoined
heat sinks
b
● 8 < drives
≤ 16
● DIMMs ≤
12
30°C (86°F)
● 0 < drives
≤ 8
● DIMMs ≤
12
35°C (95°F)
X6000 V5 C10
12 x 3.5" SAS
backplane
Intel
®
Xeon
®
Scalable
(Skylake and
Cascade Lake)
processor
(165 W < P ≤
205 W)
Wide
conjoined
heat sinks
● 4 < drives
≤ 8
● DIMMs ≤
12
30°C (86°F)
● 0 < drives
≤ 4
● DIMMs ≤
12
35°C (95°F)
Intel
®
Xeon
®
Scalable
(Skylake and
Cascade Lake)
processor (P ≤
165 W)
Narrow
conjoined
heat sinks
● Drives ≤ 12
● DIMMs ≤
16
35°C (95°F)
Wide
conjoined
heat sinks
b
● 4 < drives
≤ 8
● DIMMs ≤
12
30°C (86°F)
● 0 < drives
≤ 4
● DIMMs ≤
12
35°C (95°F)
● a: The C00 model does not support Intel
®
Xeon
®
Scalable (Gold 6144, Gold
6146, Gold 6244, and Gold 6252N) processors.
● b: When Intel
®
Xeon
®
Scalable (Gold 6144, Gold 6146, Gold 6244, or Gold
6252N) processors are configured, wide conjoined heat sinks are required to
meet the high heat dissipation requirement.
FusionServer Pro XH321 V5 Server Node
Maintenance and Service Guide
A Appendix
Issue 17 (2021-03-09)
Copyright © Huawei Technologies Co., Ltd.
164