MagnaTran 7.1 User’s Manual
Glossary
MN-003-1600-00
Brooks Automation
Revision 2.2
G-3
Cooler:
A device used to cool wafers placed into it. This is typically done after
processing in a “hot” process to prevent damage to the wafer cassette.
CPS:
See
.
Crossover:
The pressure point in a vacuum system when the rough vacuum is
switched to high vacuum.
Cryopump:
Mechanical vacuum pump used to achieve High Vacuum.
CTC:
Cluster Tool Controller.
CTO:
See
.
D1:
A SEMI standard dimension: the distance from a cassette's base to the
centerline of slot #1.
Degas:
A device used to heat wafers placed into it. This is typically done before
processing to “boil off” any contaminants or to pre-heat the wafer to
minimize processing time.
Device ID:
An optional identification code in an product transmission which serves
to distinguish the product from other devices connected to the same
host. This number is only used when the product is using RS-485 com-
munications.
DI Water:
De-ionized water.
Discrete I/O:
Discrete I/O provides monitoring and control of external device func-
tions using individual I/O pins for each function with no additional
control, or “handshaking”, lines. Typically, if a pin is being used for an
input to the product it is not used as an output also.
Dog Clamp:
A metal bar with a bolt through one side and a gripping shape on the
other side. These are used to attach modules to process chambers.
Dual Pan Arm Set:
The Brooks Automation BiSymmetrik “frog leg” arm set with two end
effectors.
EEPROM:
Electrically Erasable Programmable Read Only Memory. The EEPROM
is the device which stores product configuration information after a
store command is issued. The EEPROM retains its memory during
power off periods.
Elbow:
The joint on the robot’s arms between the inner and outer arm members.
