MagnaTran 7.1 User’s Manual
Alignment and Calibration
MN-003-1600-00
Setting the Robot to the Wafer Transport Plane
Brooks Automation
Revision 2.2
7-13
Setting the Robot to the Wafer Transport Plane
A robot controller parameter, called the Base Transfer Offset (BTO), determines the
height of the robot’s Wafer Transport Plane (WTP) for each station. The BTO is the
vertical distance from the robot’s home position to its UP, or wafer transport, position.
NOTE:
This procedure must be performed during initial setup and at any time that the
robot’s arms or end effector(s) are damaged, removed and replaced, or changed.
Required Tools and Test Equipment
•
A 6-in. steel ruler graduated in millimeters and hundredth inches
•
The robot’s Control/Display Module (CDM)
•
Expendable wafer
WARNING
Breaking wafers may produce flying shards of glass. When using
wafers in a set up or test procedure, protective eye wear should be
worn at all times to guard against possible eye injuries.
Adjustment/Calibration Strategy
This procedure uses the floor (i.e. bottom surface) of a module access slot as a refer-
ence point for determining the BTO to the WTP. The WTP is typically located .374
inches (9.5mm) above the slot center line.
Adjustment Procedure
Teach the robot the appropriate Base Transfer Offset value using the CDM as follows:
1.
Move robot End Effector A to the appropriate module station number.
2.
Move the Z axis to the UP position.
3.
Jog the (radial) R axis outward until the end effector is located inside the mod-
ule access slot, as shown in
