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3 General Safety Precautions and Usage Considerations
3-13
3.5.3 Soldering
temperature
profile
The soldering temperature and heating time vary from device to device. Therefore, when specifying the
mounting conditions, refer to the individual datasheets and databooks for the devices used.
(1) Using medium infrared ray reflow
•
Heating top and bottom with long or medium infrared rays is recommended (see Figure 3).
Long infrared ray heater (preheating)
Medium infrared ray heater
(reflow)
Product flow
Figure 3 Heating top and bottom with long or medium infrared rays
•
Complete the infrared ray reflow process for 30 to 50 seconds at a package surface temperature of between
230°C and 260°C.
•
Refer to Figure 4 for an example of a good temperature profile for infrared or hot air reflow.
230
30-50 s
Time (s)
60-120 s
(°C)
260
190
180
P
ack
age
surface tem
perature
Figure 4 Sample temperature profile (Pb free) for infrared or hot air reflow
(2) Using hot air reflow
•
Complete hot air reflow for 30 to 50 seconds at a package surface temperature of between 230°C and 260°C.
•
For an example of a recommended temperature profile, refer to Figure 4 above.
3.5.4
Flux cleaning and ultrasonic cleaning
(1) When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as Na or Cl
remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases
which can degrade device performance.
(2) Washing devices with water will not cause any problems. However, make sure that no reactive ions such as
sodium and chlorine are left as a residue. Also, be sure to dry devices sufficiently after washing.
Содержание TX49 TMPR4937
Страница 1: ...64 Bit TX System RISC TX49 Family TMPR4937 Rev 2 0 ...
Страница 4: ......
Страница 13: ...Table of Contents ix TMPR4937 Revision History 1 ...
Страница 14: ...Table of Contents x ...
Страница 15: ...Handling Precautions ...
Страница 16: ......
Страница 18: ...1 Using Toshiba Semiconductors Safely 1 2 ...
Страница 40: ...3 General Safety Precautions and Usage Considerations 3 18 ...
Страница 42: ...4 Precautions and Usage Considerations 4 2 ...
Страница 43: ...TMPR4937 2005 3 Rev 2 0 ...
Страница 44: ......
Страница 52: ...Chapter 1 Overview and Features 1 6 ...
Страница 156: ...Chapter 7 External Bus Controller 7 56 ...
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Страница 506: ...Chapter 20 Extended EJTAG Interface 20 8 ...
Страница 529: ...Chapter 22 Pinout and Package Information 22 9 22 2 Package Dimensions P BGA484 3535 1 27B9 Unit mm ...
Страница 530: ...Chapter 22 Pinout and Package Information 22 10 ...
Страница 542: ...Chapter 24 Parts Number when Ordering 24 2 ...
Страница 544: ...Appendix A TX49 H3 Core Supplement A 2 ...