Rev. 6.00, 08/04, page 14 of 628
Table 1.2
Bonding Pad Coordinates of HCD64338024, HCD64338023, HCD64338022,
HCD64338021, and HCD64338020
Coordinates
Coordinates
Pad No.
Pad Name
X (
µµµµ
m)
Y (
µµµµ
m)
Pad No.
Pad Name
X (
µµµµ
m)
Y (
µµµµ
m)
1
AV
CC
–1870
1546
42
P84/SEG29
1870
–1571
2
P13/TMIG
–1870
1274
43
P85/SEG30
1870
–1395
3
P14/
IRQ4
/
ADTRG
–1870
1058
44
P86/SEG31
1870
–1251
4
P16
–1870
909
45
P87/SEG32
1870
–1111
5
P17/
IRQ3
/TMIF
–1870
759
46
PA3/COM4
1870
–970
6
X1
–1870
608
47
PA2/COM3
1870
–831
7
X2
–1870
475
48
PA1/COM2
1870
–691
8
AV
SS
–1870
304
49
PA0/COM1
1870
–550
9
V
SS
–1870
173
50
V3
1870
–410
10
OSC2
–1870
–10
51
V2
1870
–270
11
OSC1
–1870
–150
52
V1
1870
–131
12
TEST
–1870
–290
53
V
CC
1870
10
13
RES
–1870
–425
54
V
SS
1870
150
14
P50/
WKP0
/SEG1
–1870
–560
55
P90/PWM1
1870
293
15
P51/
WKP1
/SEG2
–1870
–695
56
P91/PWM2
1870
489
16
P52/
WKP2
/SEG3
–1870
–831
57
P92
1870
685
17
P53/
WKP3
/SEG4
–1870
–966
58
P93
1870
880
18
P54/
WKP4
/SEG5
–1870
–1101
59
P94
1870
1076
19
P55/
WKP5
/SEG6
–1870
–1236
60
P95
1870
1274
20
P56/
WKP6
/SEG7
–1870
–1379
61
IRQAEC
1870
1546
21
P57/
WKP7
/SEG8
–1870
–1561
62
P30/UD
1782
1872
22
P60/SEG9
–1780
–1872
63
P31/TMOFL
1621
1872
23
P61/SEG10
–1621
–1872
64
P32/TMOFH
1084
1872
24
P62/SEG11
–1037
–1872
65
P33
948
1872
25
P63/SEG12
–896
–1872
66
P34
810
1872
26
P64/SEG13
–765
–1872
67
P35
673
1872
27
P65/SEG14
–635
–1872
68
P36/AEVH
536
1872
28
P66/SEG15
–502
–1872
69
P37/AEVL
311
1872
29
P67/SEG16
–371
–1872
70
P40/SCK32
176
1872
30
P70/SEG17
–239
–1872
71
P41/RXD32
38
1872
31
P71/SEG18
–108
–1872
72
P42/TXD32
–99
1872
32
P72/SEG19
23
–1872
73
P43/
IRQ0
–234
1872
33
P73/SEG20
156
–1872
74
PB0/AN0
–482
1872
34
P74/SEG21
287
–1872
75
PB1/AN1
–614
1872
35
P75/SEG22
419
–1872
76
PB2/AN2
–745
1872
36
P76/SEG23
550
–1872
77
PB3/AN3/
IRQ1
/TMIC
–878
1872
37
P77/SEG24
682
–1872
78
PB4/AN4
–1008
1872
38
P80/SEG25
833
–1872
79
PB5/AN5
–1148
1872
39
P81/SEG26
1040
–1872
80
PB6/AN6
–1621
1872
40
P82/SEG27
1621
–1872
81
PB7/AN7
–1782
1872
41
P83/SEG28
1782
–1872
Note:
V
SS
Pads (No. 8 and 9) should be connected to power supply lines.
TEST Pad (No. 12) should be connected to V
SS
.
If the pad of these aren’t connected to the power supply line, the LSI will not operate correctly. These values show the
coordinates of the centers of pads. The accuracy is ±5
µ
m. The home-point position is the chip’s center and the center
is located at half the distance between the upper and lower pads and left and right pads.
Summary of Contents for H8/38024 Series
Page 18: ...Rev 6 00 08 04 page xviii of xxx...
Page 30: ...Rev 6 00 08 04 page xxx of xxx...
Page 130: ...Rev 6 00 08 04 page 100 of 628...
Page 216: ...Rev 6 00 08 04 page 186 of 628...
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Page 432: ...Rev 6 00 08 04 page 402 of 628...
Page 468: ...Rev 6 00 08 04 page 438 of 628...
Page 661: ...H8 38024 H8 38024S H8 38024F ZTAT H8 38124 Group Hardware Manual...