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Appendix H Form of Bonding Pads
The form of the bonding pads for the HCD64338024, HCD64338023, HCD64338022,
HCD64338021, HCD64338020, HCD64F38024, HCD64F38024R, HCD64338024S,
HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S is shown in figure H.1.
Bonding area
Metal layer
5 mm
72 mm
5 mm
72 mm
Figure H.1 Bonding Pad Form
Summary of Contents for H8/38024 Series
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