Renesas H8/38024 Series, Hardware Manual

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Rev. 6.00, 08/04, page 13 of 628
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81 79 77 75 73 71 69 67 65 63
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80 78 76 74 72 70 68 66 64 62
25 27 29 31 33 35 37 39 41
24 26 28 30 32 34 36 38 40
Chip size: 3.99 mm
×
3.99 mm
Voltage level on the back of the chip: GND
Type code
Figure 1.5 Bonding Pad Location Diagram of HCD64338024, HCD64338023,
HCD64338022, HCD64338021, and HCD64338020 (Top View)