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Y
X
(0, 0)
Type code
Chip size: 3.84 mm
×
4.24 mm
Voltage level on the back of the chip: GND
: NC pad
Figure 1.6 Bonding Pad Location Diagram of HCD64F38024, HCD64F38024R (Top View)
Summary of Contents for H8/38024 Series
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Page 661: ...H8 38024 H8 38024S H8 38024F ZTAT H8 38124 Group Hardware Manual...
