Mitsubishi L26CPU-BT, User Manual

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[Wiring Precautions]
!
CAUTION
•
Prevent foreign matter such as dust or wire chips from entering the module.
Such foreign matter can cause a fire, failure, or malfunction.
•
A protective film is attached to the top of the module to prevent foreign matter, such as wire
chips, from entering the module during wiring.
Do not remove the film during wiring.
Remove it for heat dissipation before system operation.
•
For the CC-Link system, use dedicated cables that are specified by the manufacturer.
If any other cable is used, performance of the CC-Link system is not guaranteed.
Also, the maximum overall cable length and the station-to-station cable length must meet those
specified in Chapter 3.
If not, normal data communication is not guaranteed.
[Startup and Maintenance Precautions]
!
WARNING
•
Do not touch any terminal while power is on.
Doing so will cause electric shock or malfunction.
•
Shut off the external power supply for the system in all phases before cleaning the module or
retightening the screws on the terminal block.
Failure to do so may result in electric shock.
[Startup and Maintenance Precautions]
!
CAUTION
•
Do not disassemble or modify the modules.
Doing so may cause failure, malfunction, injury, or a fire.
•
Shut off the external power supply for the system in all phases before connecting or
disconnecting the module.
Failure to do so may cause the module to fail or malfunction.
•
Tighten the screws on the terminal block within the specified torque range.
Undertightening can cause drop of parts or wires, short circuit, or malfunction.
Overtightening can damage the screw and/or module, resulting in drop, short circuit, or
malfunction.
•
After the first use of the module, the number of module connections/disconnections is limited to
50 times.
Exceeding the limit (in accordance with IEC 61131-2) may cause malfunction.
•
Before handling the module, touch a conducting object such as a grounded metal to discharge
the static electricity from the human body.
Failure to do so may cause the module to fail or malfunction.