Intel 6300ESB ICH, Design Manual

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January 2007 299
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
Layout Checklist
Layout Checklist
13
This checklist selectively highlights some of the design considerations that should be reviewed
prior to manufacturing Intel
®
Pentium
®
M
⁄
Celeron
®
M processor systems that implement the
Intel
®
855GME/6300ESB chipset. Items contained within the checklist attempt to address
important connections to these devices and any critical supporting circuitry. This is not a complete
list, and it does not ensure that a design will function properly. Refer to details in this document
and the appended Customer Reference Board schematics for complete design recommendations.
The recommendations and considerations in this guide are subject to change.
The following recommendations are a summary of the information presented in this design guide.
They are based on the example 8-layer stackup detailed in
Chapter 3 . Deviation from the example
stackup will require thorough signal integrity and timing simulations.
13.1 Processor Checklist
Table 148 presents the processor layout checklist.