January 2007
31
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
System Overview
2.3.6.4
Packaging/Power
•
732-pin Micro-FCBGA (37.5 mm x 37.5 mm)
•
VTTLF, VTTHF (1.05 V)
•
VCC, VCCASM, VCCHL, VCCAHPLL, VCCAGPLL, VCCADPLLA, VCCADPLLB
(1.2 V or 1.35 V; as needed to support 250MHz graphics core frequency and DDR333)
•
VCCADAC, VCCDVO, VCCDLVDS, VCCALVDS, (1.5 V)
•
VCCSM, VCCQSM, VCCTXLVDS (2.5 V)
•
VCCGPIO (3.3 V)
•
Power Management (855GME)
— Optimized Clock Gating for 3D and Display Engines
— On-die thermal sensor
2.3.7
Intel
®
6300ESB System Features
The Intel
®
6300ESB I/O Controller Hub system consists of:
•
The I/O Controller Hub (Intel
®
6300ESB I/O Controller Hub) which provides the I/O
subsystem with access to the rest of the system. Additionally, it integrates many I/O functions.
The Intel
®
6300ESB I/O Controller Hub integrates:
•
Upstream Hub Interface for access to the MCH
•
Two port Serial ATA controller
•
Two channel Ultra ATA/100 Bus Master IDE controller
•
One EHCI USB 2.0 host controller and two UHCI USB 1.1 host controllers (expanded
capabilities for four ports)
•
I/O APIC
•
SMBus 2.0 controller
•
FWH interface
•
LPC interface
•
AC’97 2.2 interface
•
PCI-X 1.0 interface at 66MHz
•
PCI 2.2 interface
•
Two Serial I/O ports
•
Two-Stage Watchdog timer
2.3.8
Firmware Hub (FWH)
•
An integrated hardware Random Number Generator (RNG) on Intel parts
•
Register-based locking
Summary of Contents for 6300ESB ICH
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Page 190: ...190 Intel 855GME Chipset and Intel 6300ESB ICH Embedded Platform Design Guide Hub Interface...
Page 318: ...318 Intel 855GME Chipset and Intel 6300ESB ICH Embedded Platform Design Guide Layout Checklist...
