18
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
66 MHz PCI-X, Two Slots, Two Down Devices Routing Length Parameters ........................... 229
100 IDSEL to PXAD Bit Assignment ............................................................................................... 232
101 RTC Routing Summary ............................................................................................................ 235
102 GPIO Summary ........................................................................................................................ 242
103 Glue Chip 4 Vendor Information ............................................................................................... 247
104 Individual Clock Breakdown ..................................................................................................... 249
105 Host Clock Group Routing Constraints..................................................................................... 252
106 Clock Package Length.............................................................................................................. 253
107 CLK66 Clock Group Routing Constraints ................................................................................. 254
108 CLK33 Clock Group Routing Constraints ................................................................................. 255
109 PCICLK Clock Group Routing Constraints ............................................................................... 256
110 CLK14 Clock Group Routing Constraints ................................................................................. 257
111 DOTCLK Clock Routing Constraints ........................................................................................ 258
112 SSCCLK Clock Routing Constraints......................................................................................... 259
113 USBCLK Clock Routing Constraints......................................................................................... 260
114 SCR/SCR# Routing Guidelines ................................................................................................ 261
115 Connection Recommendations ................................................................................................ 265
116 In Target Probe (ITP)................................................................................................................ 268
117 VCCP (I/O) Decoupling Recommendations ............................................................................. 269
118 VCCA (PLL) Decoupling Recommendations ............................................................................ 269
119 VCC (CORE) Decoupling Recommendations .......................................................................... 269
120 CK409 Connection Recommendations .................................................................................... 270
121 GMCH System Memory Interface Checklist ............................................................................. 272
122 DDR DIMM Interface Checklist................................................................................................. 274
123 DIMM Decoupling Recommendation Checklist ........................................................................ 275
124 FSB Checklist ........................................................................................................................... 275
125 Hub Interface Checklist ............................................................................................................ 277
126 LVDS Checklist......................................................................................................................... 278
127 DVO Checklist .......................................................................................................................... 278
128 DAC Checklist .......................................................................................................................... 280
129 Miscellaneous Signal Checklist ................................................................................................ 281
130 GST[2:0] Configurations ........................................................................................................... 281
131 GMCH Decoupling Recommendations Checklist ..................................................................... 282
132 PCI-X Interface Checklist ......................................................................................................... 283
133 PCI Interface Checklist ............................................................................................................. 285
134 Hub Interface Checklist ............................................................................................................ 288
135 FWH/LPC Interface Checklist ................................................................................................... 288
136 GPIO Checklist ......................................................................................................................... 289
137 USB Checklist........................................................................................................................... 290
138 Power Management Checklist .................................................................................................. 290
139 CPU Signals Checklist.............................................................................................................. 291
140 System Management Checklist ................................................................................................ 292
141 RTC Checklist........................................................................................................................... 292
Summary of Contents for 6300ESB ICH
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Page 190: ...190 Intel 855GME Chipset and Intel 6300ESB ICH Embedded Platform Design Guide Hub Interface...
Page 318: ...318 Intel 855GME Chipset and Intel 6300ESB ICH Embedded Platform Design Guide Layout Checklist...