January 2007
269
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
Schematic Checklist Summary
12.1.3
Decoupling Recommendations
12.1.3.1
VCCP (I/O)
presents the VCCP (I/O) decoupling recommendations.
12.1.3.2
VCCA (PLL)
presents the VCCA (PLL) decoupling recommendations.
12.1.3.3
VCC (CORE)
presents the VCC (CORE) decoupling recommendations.
Table 117. VCCP (I/O) Decoupling Recommendations
Description
C,
μ
F
ESR, m
Ω
ESL, nH
Notes
√
Low Frequency Decoupling
(Polymer Covered Tantalum -
POSCAP, Neocap, KO Cap)
2 x 150
μ
F
42 m
Ω
(typ)/2
2.5 nH/2
Refer to
for
implementation of
recommended decoupling.
High Frequency Decoupling
(0603 MLCC, >= X7R)
10 x 0.1
μ
F
16 m
Ω
(typ)/10
0.6 nH/10
Table 118. VCCA (PLL) Decoupling Recommendations
Description
C,
μ
F
Notes
√
Mid Frequency Decoupling
(Polymer Covered Tantalum -
POSCAP, Neocap, KO Cap)
4 x 10
μ
F
Place one 10
μ
F and one 0.01
μ
F for each
VCCA pin.
High Frequency Decoupling
(0603 MLCC, >= X7R). Place
next to Pentium M processor.
4 x 0.01
μ
F
Place one 10
μ
F and one 0.01
μ
F for each
VCCA pin.
Table 119. VCC (CORE) Decoupling Recommendations (Sheet 1 of 2)
Option
Description
C,
μ
F
ESR, m
Ω
ESL, nH
√
#1
Low-Frequency Decoupling (Polymer
Covered Tantalum – POSCAP,
Neocap, KO Cap)
12 x 150
μ
F
36 m
Ω
(typ)/12
2.5 nH/12
Mid-Frequency Decoupling
(0612 MLCC, X5R or better)
15 x 2.2
μ
F
5 m
Ω
(typ)/15
0.2 nH/15
#2
Low-Frequency Decoupling
(1206 MLCC, X5R or better)
40x10
μ
F
5 m
Ω
(typ)/40
1.2 nH/40
Mid-Frequency Decoupling
(0612 MLCC, X5R or better)
15 x 2.2
μ
F
5 m
Ω
(typ)/15
0.2 nH/15
NOTES:
1. Decoupling guidelines are recommendations based on Intel reference board design. The Intel Customer
Reference Board uses option #4. This is the preferred recommendation for decoupling.
2. When deciding on overall decoupling solution, customers may need to take layout and PCB board design
into consideration.
3. Option #4 is to be used with small footprint (100 mm
2
or less) 0.36 µH
±
20% inductors.
Summary of Contents for 6300ESB ICH
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Page 190: ...190 Intel 855GME Chipset and Intel 6300ESB ICH Embedded Platform Design Guide Hub Interface...
Page 318: ...318 Intel 855GME Chipset and Intel 6300ESB ICH Embedded Platform Design Guide Layout Checklist...